PTN3341D,112 NXP Semiconductors, PTN3341D,112 Datasheet
PTN3341D,112
Specifications of PTN3341D,112
PTN3341D
PTN3341D
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PTN3341D,112 Summary of contents
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PTN3341 High speed differential line driver Rev. 01 — 6 August 2002 1. Description The PTN3341 is a differential line driver that implements the electrical characteristics of Low-Voltage Differential Signaling (LVDS) that meets or exceeds the requirements of the ANSI ...
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Philips Semiconductors 4. Ordering information Table 1: Ordering information Type number Package Name Description PTN3341DH TSSOP16 plastic thin shrink small outline package; 16 leads; body width 4.4 mm PTN3341D SO16 plastic small outline package; 16 leads; body width 3.9 mm ...
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Philips Semiconductors 6. Pinning information 6.1 Pinning Fig 2. TSSOP16 pin configuration. 6.2 Pin description Table 2: Symbol GND 9397 750 08483 Product data ...
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Philips Semiconductors 7. Functional description 7.1 Function table Table HIGH level LOW level irrelevant high impedance. Input Open Open 8. Limiting values Table 4: In ...
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Philips Semiconductors 10. Static characteristics Table 6: DC electrical characteristics Over recommended operating conditions, unless otherwise noted. Symbol Parameter V differential output voltage OD V change in differential voltage OD magnitude between logic states V Steady-state common-mode output OC(SS) voltage ...
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Philips Semiconductors 11. Dynamic characteristics Table 7: AC switching characteristics Over recommended operating conditions, unless otherwise noted. All parameters are with R = 100 , C L Symbol Parameter t Propagation delay, LOW-to-HIGH level PLH output t Propagation delay, HIGH-to-LOW ...
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Philips Semiconductors 12. Test figures Fig 4. Test circuit and voltage definitions. Fig 5. Propagation delay definitions. 9397 750 08483 Product data High speed differential line driver LVDS 100 ...
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Philips Semiconductors Fig 6. Enable and disable time definitions. 9397 750 08483 Product data High speed differential line driver 1 PHZ t PZH t t PZL ...
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Philips Semiconductors 13. Package outline TSSOP16: plastic thin shrink small outline package; 16 leads; body width 4 pin 1 index 1 e DIMENSIONS (mm are the original dimensions) A UNIT ...
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Philips Semiconductors SO16: plastic small outline package; 16 leads; body width 3 pin 1 index 1 e DIMENSIONS (inch dimensions are derived from the original mm dimensions) A UNIT max. ...
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Philips Semiconductors 14. Soldering 14.1 Introduction to soldering surface mount packages This text gives a very brief insight to a complex technology. A more in-depth account of soldering ICs can be found in our Data Handbook IC26; Integrated Circuit Packages ...
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Philips Semiconductors During placement and before soldering, the package must be fixed with a droplet of adhesive. The adhesive can be applied by screen printing, pin transfer or syringe dispensing. The package can be soldered after the adhesive is cured. ...
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Philips Semiconductors 16. Data sheet status [1] [2] Data sheet status Product status Objective data Development Preliminary data Qualification Product data Production [1] Please consult the most recently issued data sheet before initiating or completing a design. [2] The product ...
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Philips Semiconductors Contents 1 Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 2 Features . . . ...