TDA7266SA STMicroelectronics, TDA7266SA Datasheet
TDA7266SA
Specifications of TDA7266SA
Available stocks
Related parts for TDA7266SA
TDA7266SA Summary of contents
Page 1
... NO BOUCHEROT CELLS – INTERNALLY FIXED GAIN STAND-BY & MUTE FUNCTIONS SHORT CIRCUIT PROTECTION THERMAL OVERLOAD PROTECTION DESCRIPTION The TDA7266SA is a dual bridge amplifier specially designed for LCD Monitor, PC Motherboard, TV and Portable Radio applications. BLOCK AND APPLICATION DIAGRAM 0.22 F IN1 ST-BY S-GND 0 ...
Page 2
... TDA7266SA ABSOLUTE MAXIMUM RATINGS Symbol V Supply Voltage s I Output Peak Current (internally limited Total Power Dissipation (T tot T Operating Temperature Storage and Junction Temperature stg, j THERMAL DATA Symbol R Thermal Resistance Junction-case th j-case R Thermal Resistance Junction-ambient th j-amb PIN CONNECTION (Top view) ELECTRICAL CHARACTERISTCS ...
Page 3
... Test Condition for V > 6.4V -30dB CC for V < 6.4V -30dB CC A Curve 20Hzto 20KHz C1 0. 10K S-GND 9 - Vref + C3 0. 10K PW-GND 8 + TDA7266SA Min. Typ. Max 2.3 2 -075 0.8 1.3 150 470 F 100nF 1 OUT1+ 2 OUT1- 15 OUT2+ 14 OUT2- ...
Page 4
... TDA7266SA Figure 2. Microprocessor Driving Signals +V ( (mV) V ST-BY pin 7 1.8 1.3 0.8 V MUTE pin 6 4.1 2.9 2 (mA) V OUT (V) OFF ST-BY B) Low Cost Application In low cost applications where the P is not present, the suggested circuit is shown in fig.3. The St-by and mute terminals are tied together and they are connected to the supply line via an external voltage divider ...
Page 5
... ST-BY 7 S-GND 9 - Vref + MUTE 6 - PW-GND 8 + Figure 5. Gain vs Frequency Le vel(dB r) 5.0000 4.0000 3.0000 2.0000 1.0000 0.0 -1.000 -2.000 -3.000 -4.000 -5.000 10k 20k TDA7266SA 470 F 1 OUT1+ 2 OUT1- 15 OUT2+ 14 OUT2- D95AU260A Vcc = 11V 100 1k fr equenc y (Hz) C2 100nF 10k 100k 5/11 ...
Page 6
... TDA7266SA Figure 6. Mute Attenuation vs Vpin.8 Attenua tion (dB -10 -20 -30 -40 -50 -60 -70 -80 -90 -100 1 1.5 2 2.5 3 Vpin .6(V) Figure 7. Stand-By attenuation vs Vpin 9 Attenuation (dB -10 -20 -30 -40 -50 -60 -70 -80 -90 -100 -110 -120 0 0.2 0.4 0.6 0.8 1 1.2 1.4 Vpin.7 (V) 6/11 Figure 8. Quiescent Current vs Supply Voltage ...
Page 7
... Figure 9. PC Board Component Layout Figure 10. Evaluation Board Top Layer Layout Figure 11. Evaluation Board Bottom Layer Layout TDA7266SA 7/11 ...
Page 8
... TDA7266SA HEAT SINK DIMENSIONING: In order to avoid the thermal protection intervention, that is placed approximatively at T the dimensioning of the Heat Sinker R The parameters that influence the dimensioning are: – Maximum dissipated power for the device (P – Max thermal resistance Junction to case (R – Max. ambient temperature T – ...
Page 9
... A pressing force gives a good contact and the clip must be designed in order to avoid a maximum contact pressure of 15 Kg/mm2 between it and the plastic body case. As example , if a 15Kg force is applied by the clip on the package , the clip must have a contact area of 1mm2 at least. Figure 13. Example of right placement of the clip TDA7266SA 9/11 ...
Page 10
... TDA7266SA mm DIM. MIN. TYP. MAX. A 3.2 B 1.05 C 0.15 D 1.55 E 0.49 0.55 F 0.67 0.73 G 1.14 1.27 1.4 G1 17.57 17.78 17. 18.6 H3 19.85 L 17.95 L1 14.45 L2 10.7 11 11.2 L3 5.5 M 2.54 M1 2.54 10/11 inch MIN. TYP. MAX. 0.126 0.041 0.006 0.061 0.019 0.022 0.026 0.029 0.045 ...
Page 11
... Australia - Belgium - Brazil - Canada - China - Czech Republic - Finland - France - Germany - Hong Kong - India - Israel - Italy - Japan - Malaysia - Malta - Morocco - Singapore - Spain - Sweden - Switzerland - United Kingdom - United States All other names are the property of their respective owners © 2003 STMicroelectronics - All rights reserved STMicroelectronics GROUP OF COMPANIES www.st.com TDA7266SA 11/11 ...