PCA9527DP,118 NXP Semiconductors, PCA9527DP,118 Datasheet - Page 12
PCA9527DP,118
Manufacturer Part Number
PCA9527DP,118
Description
IC BUFFER SHIFT DDC 3CH 10-TSSOP
Manufacturer
NXP Semiconductors
Type
Bufferr
Specifications of PCA9527DP,118
Tx/rx Type
I²C Logic
Delay Time
115ns
Capacitance - Input
8pF
Voltage - Supply
2.7 V ~ 5.5 V
Current - Supply
100mA
Mounting Type
Surface Mount
Package / Case
10-TSSOP
Operating Temperature (min)
-40C
Operating Temperature Classification
Industrial
Operating Temperature (max)
85C
Package Type
TSSOP
Rad Hardened
No
Logic Family
PCA
Number Of Channels Per Chip
3
Supply Voltage (max)
5.5 V
Supply Voltage (min)
2.7 V
Maximum Operating Temperature
+ 85 C
Mounting Style
SMD/SMT
Interface
DDC, I2C, SMBus
Minimum Operating Temperature
- 40 C
Propagation Delay Time
115 ns
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Other names
568-4770-2
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
PCA9527DP,118
Manufacturer:
MAX
Quantity:
44
SE97/98A –Temp Sensor & SPD for DDR3 DIMM
Features
Benefits
Temperature integrated 2kbit SPD
JEDEC JC42.4 specification compliant
SE97
SE98A
2x3 DFN, 4x5 TSSOPW
Offers wide range of packages: 2x3
HUSON, 3x3 HVSON, and 4x5 TSSOP
Offers lowest height (0.5 mm or
0.8mm) on 2x3 package
– 3.0 V – 3.6 V EEPROM voltage write
– 1.7 V – 3.6 V EEPROM voltage read
– 1.7 V – 3.6 V temp sensor operation
and temp sensor operation
DIMM
Memory Bus
Memory Module
MEM
Memory Controller
MEM
SMBus
(SE98A) or Combo
Temp Sensor only
Device (SE97)
EVENT
MEM
MEM
CPU
47