BR24S64F-WE2 Rohm Semiconductor, BR24S64F-WE2 Datasheet - Page 19
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BR24S64F-WE2
Manufacturer Part Number
BR24S64F-WE2
Description
IC EEPROM 64KBIT 100KHZ SOP8
Manufacturer
Rohm Semiconductor
Series
-r
Datasheet
1.BR24L01AFV-WE2.pdf
(41 pages)
Specifications of BR24S64F-WE2
Format - Memory
EEPROMs - Serial
Memory Type
EEPROM
Memory Size
64K (8K x 8)
Speed
400kHz
Interface
I²C, 2-Wire Serial
Voltage - Supply
1.7 V ~ 5.5 V
Operating Temperature
-40°C ~ 85°C
Package / Case
8-SOIC (0.173", 4.40mm Width)
Lead Free Status / Rohs Status
Lead free / RoHS Compliant
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
BR24S64F-WE2
Manufacturer:
ROHM
Quantity:
885
Part Number:
BR24S64F-WE2
Manufacturer:
ROHM/罗姆
Quantity:
20 000
●Low voltage malfunction prevention function
●Vcc noise countermeasures
●Notes for use
© 2009 ROHM Co., Ltd. All rights reserved.
BR24L□□-W Series,BR24S□□□-W Series
www.rohm.com
3. Set SDA and SCL so as not to become 'Hi-Z'.
LVCC circuit prevents data rewrite action at low power, and prevents wrong write. At LVCC voltage (Typ. =1.2V) or below, it
prevent data rewrite.
○Bypass capacitor
(1) Described numeric values and data are design representative values, and the values are not guaranteed.
(2) We believe that application circuit examples are recommendable, however, in actual use, confirm characteristics further
(3) Absolute maximum ratings
(4) GND electric potential
(5) Terminal design
(6) Terminal to terminal shortcircuit and wrong packaging
(7) Use in a strong electromagnetic field may cause malfunction, therefore, evaluate design sufficiently.
When the above conditions 1 and 2 cannot be observed, take the following countermeasures.
a) In the case when the above condition 1 cannot be observed. When SDA becomes 'L' at power on .
b) In the case when the above condition 2 cannot be observed.
c) In the case when the above conditions 1 and 2 cannot be observed.
When noise or surge gets in the power source line, malfunction may occur, therefore, for removing these, it is
recommended to attach a by pass capacitor (0.1μF) between IC Vcc and GND. At that moment, attach it as close to IC
as possible.
And, it is also recommended to attach a bypass capacitor between board Vcc and GND.
sufficiently. In the case of use by changing the fixed number of external parts, make your decision with sufficient margin
in consideration of static characteristics and transition characteristics and fluctuations of external parts and our LSI.
If the absolute maximum ratings such as impressed voltage and action temperature range and so forth are exceeded,
LSI may be destructed. Do not impress voltage and temperature exceeding the absolute maximum ratings. In the case of
fear exceeding the absolute maximum ratings, take physical safety countermeasures such as fuses, and see to it that
conditions exceeding the absolute maximum ratings should not be impressed to LSI.
Set the voltage of GND terminal lowest at any action condition. Make sure that each terminal voltage is lower than that of
GND terminal.
In consideration of permissible loss in actual use condition, carry out heat design with sufficient margin.
When to package LSI onto a board, pay sufficient attention to LSI direction and displacement. Wrong packaging may
destruct LSI. And in the case of shortcircuit between LSI terminals and terminals and power source, terminal and GND
owing to foreign matter, LSI may be destructed.
→Control SCL and SDA as shown below, to make SCL and SDA, 'H' and 'H'.
→After power source becomes stable, execute software reset(P11).
→Carry out a), and then carry out b).
After Vcc becomes stable
SCL
SDA
V
Fig.61 When SCL= 'H' and SDA= 'L'
CC
t
DH
t
LOW
t
SU:DAT
After Vcc becomes stable
19/40
Fig.62 When SCL='L' and SDA='L'
t
SU:DAT
Technical Note
2009.09 - Rev.D