MT47H256M4CF-3:H Micron Technology Inc, MT47H256M4CF-3:H Datasheet - Page 20

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MT47H256M4CF-3:H

Manufacturer Part Number
MT47H256M4CF-3:H
Description
IC DDR2 SDRAM 1GBIT 60FBGA
Manufacturer
Micron Technology Inc
Series
-r
Datasheet

Specifications of MT47H256M4CF-3:H

Format - Memory
RAM
Memory Type
DDR2 SDRAM
Memory Size
1G (256M x 4)
Speed
3ns
Interface
Parallel
Voltage - Supply
1.7 V ~ 1.9 V
Operating Temperature
0°C ~ 85°C
Package / Case
60-TFBGA
Lead Free Status / Rohs Status
Lead free / RoHS Compliant

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
MT47H256M4CF-3:H
Manufacturer:
Micron Technology Inc
Quantity:
10 000
Figure 9: 60-Ball FBGA Package (8mm x 11.5mm) – x4, x8
PDF: 09005aef821ae8bf
1GbDDR2.pdf – Rev. V 6/10 EN
Dimensions apply to
solder balls post-
reflow on Ø0.35
SMD ball pads.
60X Ø0.45
8 CTR
Seating
0.12 A
plane
0.8 TYP
0.8 TYP
Notes:
A
9
8
7
1. All dimensions are in millimeters.
2. Solder ball material: SAC305 (96.5% Sn, 3% Ag, 0.5% Cu) or leaded Eutectic (62% Sn,
6.4 CTR
36%Pb, 2% Ag).
8 ±0.1
3
2
1
A
B
C
D
E
F
G
H
J
K
L
Exposed
gold-plated pad
1.0 MAX X 0.7
nonconductive
floating pad
0.8 ±0.1
Ball A1 ID
11.5 ±0.1
20
Micron Technology, Inc. reserves the right to change products or specifications without notice.
1Gb: x4, x8, x16 DDR2 SDRAM
0.25 MIN
1.2 MAX
© 2004 Micron Technology, Inc. All rights reserved.
Ball A1 ID
Packaging

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