TDA1519CTD NXP Semiconductors, TDA1519CTD Datasheet - Page 2

• Manufacturer Part Number: TDA1519CTD
• Manufacturer: NXP Semiconductors

Specifications of TDA1519CTD

• Operational Class: Class-B
• Audio Amplifier Output Configuration: 1-Channel Mono/2-Channel Stereo
• Output Power (typ): 22x1@4Ohm/11x2@2OhmW
• Audio Amplifier Function: Speaker
• Total Harmonic Distortion: 0.1@4Ohm@1W%
• Single Supply Voltage (typ): 14.4V
• Dual Supply Voltage (typ): Not RequiredV
• Power Supply Requirement: Single
• Power Dissipation: 25W
• Rail/rail I/o Type: No
• Single Supply Voltage (min): 6V
• Single Supply Voltage (max): 17.5V
• Dual Supply Voltage (min): Not RequiredV
• Dual Supply Voltage (max): Not RequiredV
• Mounting: Surface Mount
• Pin Count: 20
• Package Type: HSOP
• Lead Free Status / Rohs Status: Compliant

Philips Semiconductors
FEATURES
ORDERING INFORMATION
2004 Jan 28
TYPE NUMBER
TDA1519C
TDA1519CSP
TDA1519CTD
TDA1519CTH
Requires very few external components for Bridge-Tied
Load (BTL) operation
Stereo or BTL application
High output power
Low offset voltage at output (important for BTL
applications)
Fixed gain
Good ripple rejection
Mute/standby switch
Load dump protection
AC and DC short-circuit safe to ground and V
Thermally protected
Reverse polarity safe
Capability to handle high energy on outputs (V
No switch-on/switch-off plops
Protected against electrostatic discharge
Low thermal resistance
Identical inputs (inverting and non-inverting)
Pin compatible with TDA1519B (TDA1519C and
TDA1519CSP).
22 W BTL or 2
stereo power amplifier
HSOP20
HSOP20
SMS9P
NAME
SIL9P
11 W
plastic single in-line power package; 9 leads
plastic surface mounted single in-line power package; 9 leads
plastic, heatsink small outline package; 20 leads
plastic, heatsink small outline package; 20 leads; low stand-off height
P
P
= 0 V)
2
DESCRIPTION
GENERAL DESCRIPTION
The TDA1519C is an integrated class-B dual output
amplifier in a 9-lead plastic single in-line power package or
20-lead heatsink small outline package.
For the TDA1519CTH (SOT418-3), the heatsink is
positioned on top of the package, which allows an external
heatsink to be mounted on top. The heatsink of the
TDA1519CTD (SOT397-1) is facing the PCB, allowing the
heatsink to be soldered onto the copper area of the PCB.
PACKAGE
Product specification
TDA1519C
SOT131-2
SOT354-1
SOT397-1
SOT418-3
VERSION