HT1ICS3002W/V9F,00 NXP Semiconductors, HT1ICS3002W/V9F,00 Datasheet - Page 12

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HT1ICS3002W/V9F,00

Manufacturer Part Number
HT1ICS3002W/V9F,00
Description
IC UCODE SMRT LABEL UNCASED FOIL
Manufacturer
NXP Semiconductors
Datasheet

Specifications of HT1ICS3002W/V9F,00

Lead Free Status / Rohs Status
Lead free / RoHS Compliant
Product Features
Supported specifications
Memory
Write Endurance [cycles]
Data Retention [years]
RF Interface
Specifications
Form factor support
Security
Unique Serial Number [byte]
DES Engine
Exception Sensors
Certfications
Packaging
MOB6 module
MOA4 module
Sawn wafer (Au-bumped),
120 m
Sawn wafer (Au-bumped), 75 m P3SR009UF
Secure contactless payment IC
NXP Fast Pay
Visa Contactless Payment Specification
v2.0.2 A&C 3.0
PayPass Mag Stripe v3.3
100 K
20
PayPass – ISO/IEC 14443 Implementation
Specification v1.1
Cards (incl 4-line embossing), stickers,
others
7
DES3
V, f, T, light
EMVCo, CAST
P3SR009A6
P3SR009A4
P3SR009UD

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