NX3L1G53GM,125 NXP Semiconductors, NX3L1G53GM,125 Datasheet - Page 13

IC SWITCH SPDT 8XQFN

NX3L1G53GM,125

Manufacturer Part Number
NX3L1G53GM,125
Description
IC SWITCH SPDT 8XQFN
Manufacturer
NXP Semiconductors
Datasheet

Specifications of NX3L1G53GM,125

Package / Case
8-XQFN
Function
Switch
Circuit
1 x SPDT
On-state Resistance
500 mOhm
Voltage Supply Source
Single Supply
Voltage - Supply, Single/dual (±)
1.4 V ~ 4.3 V
Current - Supply
150nA
Operating Temperature
-40°C ~ 125°C
Mounting Type
Surface Mount
Switch Configuration
SPDT
On Resistance (max)
1.6 Ohm (Typ) @ 1.4 V
On Time (max)
42 ns @ 1.6 V
Off Time (max)
19 ns @ 1.6 V
Supply Voltage (max)
4.3 V
Supply Voltage (min)
1.4 V
Maximum Power Dissipation
250 mW
Maximum Operating Temperature
+ 125 C
Mounting Style
SMD/SMT
Minimum Operating Temperature
- 40 C
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Lead Free Status / RoHS Status
Lead free / RoHS Compliant, Lead free / RoHS Compliant
Other names
568-4758-2
935286015125
NX3L1G53GM,125
NX3L1G53GM-G
NX3L1G53GM-G

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
NX3L1G53GM,125
Manufacturer:
Intersil
Quantity:
754
NXP Semiconductors
NX3L1G53_4
Product data sheet
Fig 17. Test circuit for measuring break-before-make timing
Fig 18. Load circuit for switching times
a. Test circuit
b. Input and output measurement points
Test data is given in
Definitions test circuit:
R
C
V
V
L
L
EXT
I
may be connected to S or E.
= Load resistance.
= Load capacitance including jig and probe capacitance.
= External voltage for measuring switching times.
Table
V
I
11.
V
G
I
GND
V
G
IL
GND
V
V
IL
V
O
I
V
V
V
O
V
Rev. 04 — 27 January 2010
O
0.5V
R L
0.9V
R L
I
O
C L
S
Z
C L
E
S
Z
Low-ohmic single-pole double-throw analog switch
t
V
b-m
E
CC
V
CC
Y0
Y1
Y0
Y1
1
2
001aag572
switch
0.9V
V EXT = 1.5 V
001aah458
O
V EXT = 1.5 V
001aah459
NX3L1G53
© NXP B.V. 2010. All rights reserved.
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