M25P32-VMW6G Micron Technology Inc, M25P32-VMW6G Datasheet - Page 51

• Manufacturer Part Number: M25P32-VMW6G
• Manufacturer: Micron Technology Inc

Specifications of M25P32-VMW6G

• Cell Type: NOR
• Density: 32Mb
• Access Time (max): 8ns
• Interface Type: Serial (SPI)
• Address Bus: 1b
• Operating Supply Voltage (typ): 3.3V
• Operating Temp Range: -40C to 85C
• Package Type: SO W
• Sync/async: Synchronous
• Operating Temperature Classification: Industrial
• Operating Supply Voltage (min): 2.7V
• Operating Supply Voltage (max): 3.6V
• Word Size: 8b
• Number Of Words: 4M
• Supply Current: 12mA
• Mounting: Surface Mount
• Pin Count: 8
• Lead Free Status / Rohs Status: Compliant

13
Revision history
Table 21.
15-May-2003
24-Sep-2003
04-Dec-2003
10-Dec-2003
05-Aug-2004
01-Aug-2005
10-Feb-2006
28-Nov-2006
20-Jun-2003
23-Jan-2006
28-Apr-2003
01-Apr-2004
01-Oct-2004
01-Apr-2005
18-Jul-2003
Date
Document revision history
Revision
0.1
0.2
0.3
0.4
0.5
0.6
1.0
2.0
3.0
4.0
5.0
6.0
7.0
8.0
9
Target Specification Document written in brief form
Target Specification Document written in full
8x6 MLP8 and SO16(300 mil) packages added
t
SO16 package code changed. Output Timing Reference Voltage
changed.
Table of contents, warning about exposed paddle on MLP8, and Pb-free
options added.
Value of t
for VDFPN8 package.
Document promoted to Product Preview
Document promoted to Preliminary Data. Soldering temperature
information clarified for RoHS compliant devices. Device grade
information clarified
Device grade information further clarified
Document promoted to mature datasheet. Footnotes removed from P and
G options in Ordering Information table. Minor wording improvements
made.
Read Identification
Deep Power-down and Read Electronic Signature (RES)
Active Power, Standby Power and Deep Power-down modes
clarified.
Updated Page Program (PP) instructions in
Program (PP)
Fast Program/Erase mode
Program/Erase mode in
changed to W/V
(W/V
t
Program/Erase mode added.
added below
removed under
VDFPN8 package specifications updated (see
mechanical).
MLP8 5 × 6 mm and SO8W packages added (see
mechanical).
Figure 4: Bus Master and memory devices on the SPI bus
explanation added below.
Table 9: Absolute maximum
Products in T9HX technology introduced (see
characteristics (T9HX
PP
VPPHSL
, t
SE
PP
)
and t
added to Table 14: AC characteristics and t
description).
VSL
BE
(min) V
Figure 28
V
and Table 14: AC characteristics.
CC
revised
Plating Technology
PP
. (see
supply voltage
(RDID),
WI
, t
technology)). Small text changes.
All packages are RoHS compliant. Blank option
PP
Power-up and Power-down
Write Protect/Enhanced Program supply voltage
(typ) and t
added and Power-up specified for Fast
Deep Power-down (DP)
ratings: V
Figure 27: V
Changes
and
in
BE
V
Table 20
IO
(typ) changed. Change of naming
SS
max modified and T
PPH
ground
Page
Table 15: AC
timing
Section 11: Package
Programming,
descriptions added.
Section 11: Package
PP
and
section. W pin
inserted. Note
for Fast
instructions, and
Release from
updated and
LEAD
paragraph
Page
added.
2
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