AM29F400AB-90SC Spansion Inc., AM29F400AB-90SC Datasheet
AM29F400AB-90SC
Specifications of AM29F400AB-90SC
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AM29F400AB-90SC Summary of contents
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Am29F400B Known Good Die Data Sheet (Retired Product) This product has been retired and is not recommended for designs. Please contact your Spansion representative for alternates. Availability of this document is retained for reference and historical purposes only. The following ...
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This page left intentionally blank Am29F400B Known Good Die 21258_E7 March 3, 2009 ...
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... Am29F400B Known Good Die 4 Megabit (512 K x 8-Bit/256 K x 16-Bit) CMOS 5.0 Volt-only, Boot Sector Flash Memory—Die Revision 2 This product has been retired and is not recommended for designs. Please contact your Spansion representative for alternates. Availability of this document is retained for reference and historical purposes only. ...
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... Write cycles also internally latch addresses and data needed for the programming and erase operations. Reading data out of the device is similar to reading from other Flash or EPROM devices. Device programming occurs by executing the program command sequence. This initiates the Embedded Program algorithm— ...
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PRODUCT SELECTOR GUIDE Family Part Number V CC Speed Option V CC Max access time ACC Max CE# access time Max OE# access time DIE PHOTOGRAPH ...
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PAD DESCRIPTION Pad Signal DQ4 3 DQ12 4 DQ5 5 DQ13 6 DQ6 7 DQ14 8 DQ7 9 DQ15/A BYTE# 12 A16 13 A15 14 A14 15 A13 16 A12 17 A11 ...
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... Surftape™ (Tape and Reel) 2500 per 7-inch reel SPEED OPTION See Product Selector Guide and Valid Combinations BOOT CODE SECTOR ARCHITECTURE T = Top sector B = Bottom sector CMOS Flash Memory—Die Revision 2 Valid Combinations DPC 2, DPI 2, DPE 2, DTC 2, DTI 2, DTE 2, Am29F400B Known Good Die ° C) ° ...
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PACKAGING INFORMATION Surftape Packaging Direction of Feed Waffle Pack Packaging Orientation relative to top left corner of Waffle Pack cavity plate Am29F400B Known Good Die Orientation relative to leading ...
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PRODUCT TEST FLOW Figure 1 provides an overview of AMD’s Known Good Die test flow. For more detailed information, refer to the Am29F400B product qualification database supple- ment for KGD. AMD implements quality assurance pro- cedures throughout the product test ...
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PHYSICAL SPECIFICATIONS Die Dimensions . . . . . . . . . . . . . . 135 mils x 198 mils . . . . . . . . . . . . . . . . . ...
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TERMS AND CONDITIONS OF SALE FOR AMD NON-VOLATILE MEMORY DIE All transactions relating to unpackaged die under this agreement shall be subject to AMD’s standard terms and conditions of sale, or any revisions thereof, which revisions AMD reserves the right ...
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REVISION SUMMARY Revision A (May 1997) Initial release. Revision B (January 1998) Formatted to match current template. Updated Distinc- tive Characteristics and General Description sections using the current main data sheet. Updated for CS39 process technology. Revision B+1 (February 1998) ...
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... Copyright © 1997–2005 Advanced Micro Devices, Inc. All rights reserved. AMD, the AMD logo, and combinations thereof are registered trademarks of Advanced Micro Devices, Inc. Product names used in this publication are for identification purposes only and may be trademarks of their respective companies. Copyright © 2006-2009 Spansion Inc. All rights reserved. Spansion ™ ™ ...