AM29F400AB-90SC Spansion Inc., AM29F400AB-90SC Datasheet - Page 9

• Manufacturer Part Number: AM29F400AB-90SC
• Manufacturer: Spansion Inc.

Specifications of AM29F400AB-90SC

• Cell Type: NOR
• Density: 4Mb
• Access Time (max): 90ns
• Interface Type: Parallel
• Boot Type: Bottom
• Address Bus: 19/18Bit
• Operating Supply Voltage (typ): 5V
• Operating Temp Range: 0C to 70C
• Package Type: SO
• Program/erase Volt (typ): 4.5 to 5.5V
• Sync/async: Asynchronous
• Operating Temperature Classification: Commercial
• Operating Supply Voltage (min): 4.5V
• Operating Supply Voltage (max): 5.5V
• Word Size: 8/16Bit
• Number Of Words: 512K/256K
• Supply Current: 50mA
• Mounting: Surface Mount
• Pin Count: 44
• Lead Free Status / Rohs Status: Not Compliant

PRODUCT TEST FLOW
Figure 1 provides an overview of AMD’s Known Good
Die test flow. For more detailed information, refer to the
Am29F400B product qualification database supple-
ment for KGD. AMD implements quality assurance pro-
cedures throughout the product test flow. In addition,
Packaging for Shipment
High Temperature
24 hours at 250°C
Figure 1. AMD KGD Product Test Flow
Wafer Sort 1
Wafer Sort 3
Wafer Sort 2
Shipment
Am29F400B Known Good Die
Bake
S U P P L E M E N T
an off-line quality monitoring program (QMP) further
guarantees AMD quality standards are met on Known
Good Die products. These QA procedures also allow
AMD to produce KGD products without requiring or
implementing burn-in.
Data Retention
Incoming Inspection
Wafer Saw
Die Separation
100% Visual Inspection
Die Pack
DC Parameters
Functionality
Programmability
Erasability
DC Parameters
Functionality
Programmability
Erasability
DC Parameters
Functionality
Programmability
Erasability
Speed
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