AM29F400AB-90SC Spansion Inc., AM29F400AB-90SC Datasheet - Page 12

• Manufacturer Part Number: AM29F400AB-90SC
• Manufacturer: Spansion Inc.

Specifications of AM29F400AB-90SC

• Cell Type: NOR
• Density: 4Mb
• Access Time (max): 90ns
• Interface Type: Parallel
• Boot Type: Bottom
• Address Bus: 19/18Bit
• Operating Supply Voltage (typ): 5V
• Operating Temp Range: 0C to 70C
• Package Type: SO
• Program/erase Volt (typ): 4.5 to 5.5V
• Sync/async: Asynchronous
• Operating Temperature Classification: Commercial
• Operating Supply Voltage (min): 4.5V
• Operating Supply Voltage (max): 5.5V
• Word Size: 8/16Bit
• Number Of Words: 512K/256K
• Supply Current: 50mA
• Mounting: Surface Mount
• Pin Count: 44
• Lead Free Status / Rohs Status: Not Compliant

REVISION SUMMARY
Revision A (May 1997)
Initial release.
Revision B (January 1998)
Formatted to match current template. Updated Distinc-
tive Characteristics and General Description sections
using the current main data sheet. Updated for CS39
process technology.
Revision B+1 (February 1998)
Distinctive Characteristics
The minimum guarantee per sector is now 1 million cycles.
Global
Added -75 and -90 speed options.
Pad Description
Corrected coordinates for pads 2, 19, 22, 35, 40, and 42.
Physical Specifications
Changed die thickness specification to ~20 mils.
Revision B+2 (May 1998)
Die Pad Locations
Moved AMD logo to above pad 23.
Revision C (June 1998)
Distinctive Characteristics
Changed “Manufactured on 0.35 µm process technology”
to “Manufactured on 0.32 µm process technology”.
General Description
Third paragraph: Changed “AMD’s 0.35 µm process
technology” to “AMD’s 0.32 µm process technology”.
Die Photograph
Replaced with photograph of Die Revision 2.
Die Pad Locations
Corrected the location of the AMD logo to above pad 22
from pad above pad 13. Modified figure to match new
die photograph.
Pad Description
Replaced table with new pad coordinates.
Physical Specifications
Die Dimensions: Changed to 135 mils x 198 mils, 3.43
mm x 5.03 mm from 141.34 mils x 207.48 mils, 3.59
mm x 5.27 mm.
Die Thickness: Added ~500 µm.
Pad Area Free of Passivation: Changed to 20.85 mils
and 13,433 µm
Passivation: Changed to SiN/SOG/SiN from Nitride/
SOG/Nitride.
10
2
from 15.52 mils
2
and 10,000 µm
Am29F400B Known Good Die
S U P P L E M E N T
2
.
2
Manufacturing Information
Manufacturing ID: Changed to 98F02AK (top boot) and
98F02ABK (bottom boot) from 98965AK (top boot) and
98965ABK (bottom boot).
Fabrication Process: Changed to CS39S from CS39.
Die Revision: Changed to 2 from 1.
Revision C+1 (September 1998)
Page 5, Ordering Information
Package Type and Minimum Order Quantity: Changed
Waffle Pack to 140 die per 5 tray stack from 180 die per
5 tray stack. Changed Gel-Pak
6 tray stack from 378 die per 6 tray stack. Changed Sur-
ftape™ (Tape and Reel) to 2500 per 7-inch reel from
1800 per 7-inch reel.
Page 7, Physical Specifications
Die Dimensions: Changed to 3.42 mm x 5.02 mm from
3.43 mm x 5.03 mm.
Bond Pad Size: Changed to 4.7 mils x 4.7 mils and
119.7 µm x 119.7 µm from 3.74 mils x 3.74 mils and
95 µm x 95 µm.
Pad Area Free of Passivation: Changed to 13.98 mils
and 9,025 µm
Bond Pad Metallization: Changed to Al/Cu from Al/Cu/Si.
Page 7, Manufacturing Information
Manufacturing ID (Top Boot): Changed to 98F02AK
from 98F02A.
Revision D (November 1998)
Global
Revised document specifications for die shrink from
0.35 µm to 0.32 µm process technology.
Terms and Conditions
Replaced warranty with new version.
Revision E (December 1998)
Packaging Information
Added section. Moved orientation information from die
photograph section into this section.
Revision E+1 (February 1999)
Die Pad Locations
Corrected top row of pad callouts.
Revision E+2 (June 14, 1999)
Physical Specifications
Corrected the bond pad dimensions.
2
from 20.85 mils
®
2
Die Tray to 594 die per
and 13,433 µm
2
.
2