AM29F400AB-90SC Spansion Inc., AM29F400AB-90SC Datasheet - Page 13

• Manufacturer Part Number: AM29F400AB-90SC
• Manufacturer: Spansion Inc.

Specifications of AM29F400AB-90SC

• Cell Type: NOR
• Density: 4Mb
• Access Time (max): 90ns
• Interface Type: Parallel
• Boot Type: Bottom
• Address Bus: 19/18Bit
• Operating Supply Voltage (typ): 5V
• Operating Temp Range: 0C to 70C
• Package Type: SO
• Program/erase Volt (typ): 4.5 to 5.5V
• Sync/async: Asynchronous
• Operating Temperature Classification: Commercial
• Operating Supply Voltage (min): 4.5V
• Operating Supply Voltage (max): 5.5V
• Word Size: 8/16Bit
• Number Of Words: 512K/256K
• Supply Current: 50mA
• Mounting: Surface Mount
• Pin Count: 44
• Lead Free Status / Rohs Status: Not Compliant

Revision E+3 (July 12, 1999)
Ordering Information
Corrected the die revision indicated in the example and
the valid combinations to 2.
Revision E+4 (November 17, 1999)
Distinctive Characteristics, Ordering Information,
DC Operating Conditions
Added note to contact AMD for higher temperature
range.
Revision E+5 (June 27, 2001)
Manufacturing Information
Added Penang, Malaysia as a test facility (ACN2016).
Colophon
The products described in this document are designed, developed and manufactured as contemplated for general use, including without
limitation, ordinary industrial use, general office use, personal use, and household use, but are not designed, developed and manufactured as
contemplated (1) for any use that includes fatal risks or dangers that, unless extremely high safety is secured, could have a serious effect to the
public, and could lead directly to death, personal injury, severe physical damage or other loss (i.e., nuclear reaction control in nuclear facility,
aircraft flight control, air traffic control, mass transport control, medical life support system, missile launch control in weapon system), or (2) for
any use where chance of failure is intolerable (i.e., submersible repeater and artificial satellite). Please note that Spansion will not be liable to
you and/or any third party for any claims or damages arising in connection with above-mentioned uses of the products. Any semiconductor
devices have an inherent chance of failure. You must protect against injury, damage or loss from such failures by incorporating safety design
measures into your facility and equipment such as redundancy, fire protection, and prevention of over-current levels and other abnormal
operating conditions. If any products described in this document represent goods or technologies subject to certain restrictions on export under
the Foreign Exchange and Foreign Trade Law of Japan, the US Export Administration Regulations or the applicable laws of any other country,
the prior authorization by the respective government entity will be required for export of those products.
Trademarks and Notice
The contents of this document are subject to change without notice. This document may contain information on a Spansion product under
development by Spansion. Spansion reserves the right to change or discontinue work on any product without notice. The information in this
document is provided as is without warranty or guarantee of any kind as to its accuracy, completeness, operability, fitness for particular purpose,
merchantability, non-infringement of third-party rights, or any other warranty, express, implied, or statutory. Spansion assumes no liability for any
damages of any kind arising out of the use of the information in this document.
Copyright © 1997–2005 Advanced Micro Devices, Inc. All rights reserved. AMD, the AMD logo, and combinations thereof are registered
trademarks of Advanced Micro Devices, Inc. Product names used in this publication are for identification purposes only and may be trademarks
of their respective companies.
Copyright © 2006-2009 Spansion Inc. All rights reserved. Spansion
ORNAND2
used are for informational purposes only and may be trademarks of their respective owners.
™
, HD-SIM
™
, EcoRAM
™
and combinations thereof, are trademarks of Spansion LLC in the US and other countries. Other names
Am29F400B Known Good Die
S U P P L E M E N T
®
, the Spansion Logo, MirrorBit
Revision E+6 (July 19, 2007)
Ordering Information
Removed package type options DG and DW
Modified Valid Combination table
Packaging Information
Removed all references to Gel-Pak
Revision E7 (March 3, 2009)
Global
Added obsolescence information.
®
, MirrorBit
®
Eclipse
™
, ORNAND
™
,
11