BUK218-50DY NXP Semiconductors, BUK218-50DY Datasheet - Page 8

• Manufacturer Part Number: BUK218-50DY
• Manufacturer: NXP Semiconductors

Specifications of BUK218-50DY

• Switch Type: High Side
• Power Switch Family: BUK218-50DY
• Input Voltage: 6 to 35V
• Power Switch On Resistance: 100mOhm
• Output Current: 8A
• Number Of Outputs: Dual
• Mounting: Surface Mount
• Supply Current: 3.6mA
• Package Type: D2PAK
• Operating Temperature (min): -40C
• Operating Temperature (max): 150C
• Operating Temperature Classification: Automotive
• Pin Count: 6 +Tab
• Power Dissipation: 83.3W
• Lead Free Status / Rohs Status: Compliant

Philips Semiconductors
MECHANICAL DATA
1 Epoxy meets UL94 V0 at 1/8". Net mass: 1.5 g.
May 2001
TOPFET dual high side switch
For soldering guidelines and SMD footprint design, please refer to Data Handbook SC18.
Plastic single-ended surface mounted package (Philips version of D
7 leads (one lead cropped)
DIMENSIONS (mm are the original dimensions)
UNIT
mm
Fig.4. SOT427 surface mounting package
OUTLINE
VERSION
SOT427
4.50
4.10
A
H D
1.40
1.27
A 1
D
D 1
0.85
0.60
b
IEC
1
0.64
0.46
c
e
max.
e
11
D
e
E
JEDEC
4
1.60
1.20
D 1
e
REFERENCES
e
10.30
9.70
E
e
0
7
1.27
e
b
scale
EIAJ
2.5
8
1
2.90
2.10
, centre pin connected to mounting base.
L p
5 mm
15.80
14.80
H D
mounting
2.60
2.20
2
Q
-PAK);
base
L p
A 1
Q
PROJECTION
c
EUROPEAN
A
ISSUE DATE
99-06-25
01-04-18
BUK218-50DY
Product specification
SOT427
Rev 1.400