LH28F320BFHE-PBTLZ2 Sharp Electronics, LH28F320BFHE-PBTLZ2 Datasheet - Page 4
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LH28F320BFHE-PBTLZ2
Manufacturer Part Number
LH28F320BFHE-PBTLZ2
Description
Manufacturer
Sharp Electronics
Datasheet
1.LH28F320BFHE-PBTLZ2.pdf
(38 pages)
Specifications of LH28F320BFHE-PBTLZ2
Cell Type
NOR
Density
32Mb
Access Time (max)
80ns
Interface Type
Parallel
Boot Type
Bottom
Address Bus
21b
Operating Supply Voltage (typ)
3.3V
Operating Temp Range
-40C to 85C
Package Type
TSOP
Sync/async
Asynchronous
Operating Temperature Classification
Industrial
Operating Supply Voltage (min)
2.7V
Operating Supply Voltage (max)
3.6V
Word Size
16b
Number Of Words
2M
Supply Current
25mA
Mounting
Surface Mount
Pin Count
48
Lead Free Status / Rohs Status
Not Compliant
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
LH28F320BFHE-PBTLZ2
Manufacturer:
SAMSUNG
Quantity:
1 600
48-Lead TSOP Pinout................................................. 3
Pin Descriptions.......................................................... 4
Simultaneous Operation Modes
Memory Map .............................................................. 6
Identifier Codes and OTP Address
Identifier Codes and OTP Address for
OTP Block Address Map for OTP Program............... 8
Bus Operation............................................................. 9
Command Definitions .............................................. 10
Functions of Block Lock and Block Lock-Down..... 12
Block Locking State Transitions upon
Block Locking State Transitions upon
Status Register Definition......................................... 14
Allowed with Four Planes .................................. 5
for Read Operation ............................................. 7
Read Operation on Partition Configuration........ 7
Command Write................................................ 12
WP# Transition................................................. 13
PAGE
CONTENTS
LHF32FD2
Extended Status Register Definition ......................... 15
Partition Configuration Register Definition.............. 16
Partition Configuration ............................................. 16
1 Electrical Specifications......................................... 17
2 Related Document Information.............................. 29
1.1 Absolute Maximum Ratings ........................... 17
1.2 Operating Conditions ...................................... 17
1.2.1 Capacitance .............................................. 18
1.2.2 AC Input/Output Test Conditions ............ 18
1.2.3 DC Characteristics ................................... 19
1.2.4 AC Characteristics
1.2.5 AC Characteristics
1.2.6 Reset Operations ...................................... 27
1.2.7 Block Erase, Full Chip Erase,
- Read-Only Operations......................... 21
- Write Operations ................................. 25
(Page Buffer) Program and
OTP Program Performance.................... 28
Rev. 2.44
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