LH28F320BFHE-PBTLZ2 Sharp Electronics, LH28F320BFHE-PBTLZ2 Datasheet - Page 8
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LH28F320BFHE-PBTLZ2
Manufacturer Part Number
LH28F320BFHE-PBTLZ2
Description
Manufacturer
Sharp Electronics
Datasheet
1.LH28F320BFHE-PBTLZ2.pdf
(38 pages)
Specifications of LH28F320BFHE-PBTLZ2
Cell Type
NOR
Density
32Mb
Access Time (max)
80ns
Interface Type
Parallel
Boot Type
Bottom
Address Bus
21b
Operating Supply Voltage (typ)
3.3V
Operating Temp Range
-40C to 85C
Package Type
TSOP
Sync/async
Asynchronous
Operating Temperature Classification
Industrial
Operating Supply Voltage (min)
2.7V
Operating Supply Voltage (max)
3.6V
Word Size
16b
Number Of Words
2M
Supply Current
25mA
Mounting
Surface Mount
Pin Count
48
Lead Free Status / Rohs Status
Not Compliant
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
LH28F320BFHE-PBTLZ2
Manufacturer:
SAMSUNG
Quantity:
1 600
NOTES:
1. "X" denotes the operation available.
2. Configurative Partition Dual Work Restrictions:
PARTITION IS:
Full Chip Erase
Word Program
Read ID/OTP
OTP Program
Status register reflects partition state, not WSM (Write State Machine) state - this allows a status register for each
partition. Only one partition can be erased or programmed at a time - no command queuing.
Commands must be written to an address within the block targeted by that command.
Block Erase
Block Erase
Read Status
Read Query
Page Buffer
Read Array
Program
Suspend
Suspend
IF ONE
Program
Array
Read
X
X
X
X
X
X
X
X
X
Table 2. Simultaneous Operation Modes Allowed with Four Planes
ID/OTP
Read
X
X
X
X
X
X
X
X
X
THEN THE MODES ALLOWED IN THE OTHER PARTITION IS:
Status
Read
X
X
X
X
X
X
X
X
X
X
X
Query
Read
X
X
X
X
X
X
X
X
X
Program
LHF32FD2
Word
X
X
X
X
X
Program
Buffer
Page
X
X
X
X
X
Program
OTP
X
Block
Erase
X
X
X
X
(1, 2)
Full Chip
Erase
X
Program
Suspend
X
X
X
X
X
Rev. 2.44
Suspend
Block
Erase
X
X
X
X
X
X
X
5