MC9S08GT16CFB Freescale Semiconductor, MC9S08GT16CFB Datasheet - Page 240

MC9S08GT16CFB

Manufacturer Part Number
MC9S08GT16CFB
Description
Manufacturer
Freescale Semiconductor
Datasheet

Specifications of MC9S08GT16CFB

Cpu Family
HCS08
Device Core Size
8b
Frequency (max)
20MHz
Interface Type
SCI/SPI
Program Memory Type
Flash
Program Memory Size
16KB
Total Internal Ram Size
1KB
# I/os (max)
36
Number Of Timers - General Purpose
4
Operating Supply Voltage (typ)
2.5/3.3V
Operating Supply Voltage (max)
3.6V
Operating Supply Voltage (min)
2.08V
On-chip Adc
8-chx10-bit
Instruction Set Architecture
CISC
Operating Temp Range
-40C to 85C
Operating Temperature Classification
Industrial
Mounting
Surface Mount
Pin Count
44
Package Type
PQFP
Lead Free Status / Rohs Status
Not Compliant

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Development Support
Figure 15-3
shows the host receiving a logic 1 from the target HCS08 MCU. Because the host is
asynchronous to the target MCU, there is a 0-to-1 cycle delay from the host-generated falling edge on
BKGD to the perceived start of the bit time in the target MCU. The host holds the BKGD pin low long
enough for the target to recognize it (at least two target BDC cycles). The host must release the low drive
before the target MCU drives a brief active-high speedup pulse seven cycles after the perceived start of the
bit time. The host should sample the bit level about 10 cycles after it started the bit time.
BDC CLOCK
(TARGET MCU)
HOST DRIVE
HIGH-IMPEDANCE
TO BKGD PIN
TARGET MCU
SPEEDUP PULSE
HIGH-IMPEDANCE
HIGH-IMPEDANCE
PERCEIVED START
OF BIT TIME
R-C RISE
BKGD PIN
10 CYCLES
EARLIEST START
OF NEXT BIT
10 CYCLES
HOST SAMPLES BKGD PIN
Figure 15-3. BDC Target-to-Host Serial Bit Timing (Logic 1)
MC9S08GB/GT Data Sheet, Rev. 2.3
240
Freescale Semiconductor

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