CY7C1361B-100AJC Cypress Semiconductor Corp, CY7C1361B-100AJC Datasheet - Page 24
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CY7C1361B-100AJC
Manufacturer Part Number
CY7C1361B-100AJC
Description
Manufacturer
Cypress Semiconductor Corp
Datasheet
1.CY7C1361B-100AJC.pdf
(34 pages)
Specifications of CY7C1361B-100AJC
Density
9Mb
Access Time (max)
8.5ns
Sync/async
Synchronous
Architecture
SDR
Clock Freq (max)
100MHz
Operating Supply Voltage (typ)
3.3V
Address Bus
18b
Package Type
TQFP
Operating Temp Range
0C to 70C
Number Of Ports
1
Supply Current
180mA
Operating Supply Voltage (min)
3.135V
Operating Supply Voltage (max)
3.6V
Operating Temperature Classification
Commercial
Mounting
Surface Mount
Pin Count
100
Word Size
36b
Number Of Words
256K
Lead Free Status / Rohs Status
Not Compliant
Document #: 38-05302 Rev. *B
AC Test Loads and Waveforms
Note:
Thermal Resistance
Capacitance
14. Tested initially and after any design or process change that may affect these parameters.
C
C
C
IN
CLK
I/O
OUTPUT
OUTPUT
Parameter
Parameter
3.3V I/O Test Load
2.5V I/O Test Load
Θ
Θ
JA
JC
[14]
Z
Z
Thermal Resistance
(Junction to Ambient)
Thermal Resistance
(Junction to Case)
0
0
= 50Ω
= 50Ω
Input Capacitance
Clock Input Capacitance
Input/Output Capacitance
Description
(a)
(a)
V
V
[14]
L
Description
L
= 1.25V
= 1.5V
R
R
L
L
= 50Ω
= 50Ω
OUTPUT
OUTPUT
3.3V
2.5V
Test conditions follow standard
test methods and procedures
for measuring thermal
impedance, per EIA / JESD51.
INCLUDING
INCLUDING
JIG AND
T
V
V
JIG AND
SCOPE
SCOPE
A
DD
DDQ
Test Conditions
5 pF
5 pF
= 25°C, f = 1 MHz,
= 3.3V.
Test Conditions
= 2.5V
(b)
(b)
R = 317Ω
R = 1667Ω
R = 351Ω
R =1538Ω
V
Package
Package
GND
GND
DD
TQFP
V
TQFP
25
DD
9
≤ 1ns
≤ 1ns
5
5
5
10%
10%
Package
Package
ALL INPUT PULSES
ALL INPUT PULSES
BGA
BGA
25
5
5
7
6
90%
90%
(c)
(c)
Package
Package
fBGA
CY7C1361B
CY7C1363B
fBGA
27
5
5
7
6
Page 24 of 34
90%
90%
10%
10%
°C/W
°C/W
Unit
≤ 1ns
≤ 1ns
Unit
pF
pF
pF
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