TE28F320C3BD90 Micron Technology Inc, TE28F320C3BD90 Datasheet - Page 69
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TE28F320C3BD90
Manufacturer Part Number
TE28F320C3BD90
Description
Manufacturer
Micron Technology Inc
Datasheet
1.TE28F320C3BD90.pdf
(70 pages)
Specifications of TE28F320C3BD90
Density
32Mb
Access Time (max)
90ns
Interface Type
Parallel
Boot Type
Bottom
Address Bus
21b
Operating Supply Voltage (typ)
3/3.3V
Operating Temp Range
-40C to 85C
Package Type
TSOP
Sync/async
Asynchronous
Operating Temperature Classification
Industrial
Operating Supply Voltage (min)
2.7V
Operating Supply Voltage (max)
3.6V
Word Size
16b
Number Of Words
2M
Supply Current
18mA
Mounting
Surface Mount
Pin Count
48
Lead Free Status / Rohs Status
Not Compliant
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
TE28F320C3BD90
Manufacturer:
INTEL
Quantity:
1 831
C3 Discrete
Appendix E Ordering Information
Figure 23: Component Ordering Information
March 2008
290645-24
Package
TE = 48- Lead TSOP
GT = 48- Ball µBGA * CSP
GE = VF BGA CSP
RC = Easy BGA
PC = Pb Free Easy BGA
PH = Pb Free VFBGA
JS = Pb Free TSOP
Device Density
640 = x16 (64 Mbit)
320 = x16 (32 Mbit)
160 = x16 (16 Mbit)
800 = x16 (8 Mbit)
Product line designator
for all Intel
®
Flash products
T E 2 8 F 3 2 0 C 3 T C 7 0
Access Speed (ns)
(70, 80 , 90, 100 , 110 )
T = Top Blocking
B = Bottom Blocking
Product Family
C3 = 3 Volt Advanced+ Boot Block
V
V
CC
PP
Lithography
A = 0.25 µm
C = 0.18 µm
D = 0.13 µm
= 2 .7 V–3 .6 V or
= 2.7 V–3.6 V
11 . 4 V–12 .6 V
Datasheet
69