TE28F256J3C125 Intel, TE28F256J3C125 Datasheet - Page 13
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TE28F256J3C125
Manufacturer Part Number
TE28F256J3C125
Description
Manufacturer
Intel
Datasheet
1.TE28F256J3C125.pdf
(72 pages)
Specifications of TE28F256J3C125
Cell Type
NOR
Density
256Mb
Access Time (max)
125ns
Interface Type
Parallel
Boot Type
Not Required
Address Bus
25/24Bit
Operating Supply Voltage (typ)
3/3.3V
Operating Temp Range
-40C to 85C
Package Type
TSOP
Program/erase Volt (typ)
2.7 to 3.6V
Sync/async
Asynchronous
Operating Temperature Classification
Industrial
Operating Supply Voltage (min)
2.7V
Operating Supply Voltage (max)
3.6V
Word Size
8/16Bit
Number Of Words
32M/16M
Mounting
Surface Mount
Pin Count
56
Lead Free Status / Rohs Status
Not Compliant
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
TE28F256J3C125
Manufacturer:
INTEL
Quantity:
5 510
Company:
Part Number:
TE28F256J3C125
Manufacturer:
TSOP
Quantity:
4 800
Company:
Part Number:
TE28F256J3C125SL7HD
Manufacturer:
SANREX
Quantity:
210
3.3
Datasheet
D im e n s io n s T a b le
N o te : ( 1 ) P a c k a g e d im e n s io n s a re f o r r e f e re n c e o n ly . T h e s e d im e n s io n s a re e s t im a te s b a s e d o n d ie s iz e ,
a n d a r e s u b j e c t t o c h a n g e .
Figure 5. Intel StrataFlash
C o r n e r
Pa c k a g e H e ig h t
Ba ll H e ig h t
Pa c k a g e B o d y T h ic k n e s s
Ba ll (L e a d ) W id th
Pa c k a g e B o d y L e n g t h
Pitc h
Ba ll (L e a d ) C o u n t
Se a tin g P la n e C o p la n a r ity
Co r n e r to B a ll A 1 D is ta n c e A lo n g D
Co r n e r to B a ll A 1 D is ta n c e A lo n g E
B a ll A 1
E
A 2
C
A
B
D
E
F
VF-BGA (J3) Package
NOTES:
1. For Daisy Chain Evaluation Unit information refer to the Intel Flash Memory Packaging Technology Web
2. For Packaging Shipping Media information refer to the Intel Flash Memory Packaging Technology Web page
page at; www.intel.com/design/packtech/index.htm
at; www.intel.com/design/packtech/index.htm
1
T o p V ie w - B u m p S id e D o w n
A 1
2
3
S id e V ie w
4
D
5
®
Memory (J3) VF BGA Mechanical Specifications
6
7
8
S y m b o l
A
A
[ e ]
S
S
A
D
N
b
E
Y
1
2
1
2
A
M illim e te rs
1 0 .7 5 0
S e a t in g
0 .1 5 0
0 .3 2 5
7 .1 8 6
0 .9 1 8
3 .4 5 0
P la n e
M in
D
A
B
C
E
F
1 0 . 8 5 0
b
N o m
0 .6 6 5
0 .3 7 5
7 .2 8 6
0 .7 5 0
1 .0 1 8
3 .5 5 0
8
4 8
B o tt o m V ie w - B a ll S id e U p
7
6
1 0 .9 5 0
1 . 0 0 0
0 . 4 2 5
7 . 3 8 6
0 . 1 0 0
1 . 1 1 8
3 . 6 5 0
M a x
5
N o te : D r a w in g n o t t o s ca le
N o te s
4
1
1
1
1
3
Y
I n c h e s
0 .0 0 5 9
0 .0 1 2 8
0 .2 8 2 9
0 .4 2 3 2
0 .0 3 6 1
0 .1 3 5 8
2
M in
1
256-Mbit J3 (x8/x16)
S 1
e
0 .0 2 6 2
0 .0 1 4 8
0 .2 8 6 8
0 .4 2 7 2
0 .0 2 9 5
0 .0 4 0 1
0 .1 3 9 8
N o m
4 8
B all A1
C o r n e r
S 2
0 .0 3 9 4
0 .0 1 6 7
0 .2 9 0 8
0 .4 3 1 1
0 .0 0 3 9
0 .0 4 4 0
0 .1 4 3 7
M a x
13