TE28F160C3BA90 Micron Technology Inc, TE28F160C3BA90 Datasheet - Page 8

• Manufacturer Part Number: TE28F160C3BA90
• Manufacturer: Micron Technology Inc

Specifications of TE28F160C3BA90

• Density: 16Mb
• Access Time (max): 90ns
• Interface Type: Parallel
• Boot Type: Bottom
• Address Bus: 20b
• Operating Supply Voltage (typ): 3/3.3V
• Operating Temp Range: -40C to 85C
• Package Type: TSOP
• Sync/async: Asynchronous
• Operating Temperature Classification: Industrial
• Operating Supply Voltage (min): 2.7V
• Operating Supply Voltage (max): 3.6V
• Word Size: 16b
• Number Of Words: 1M
• Supply Current: 18mA
• Mounting: Surface Mount
• Pin Count: 48
• Lead Free Status / Rohs Status: Not Compliant

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Datasheet
8
Conventions
The terms pin and signal are often used interchangeably to refer to the external signal
connections on the package; for chip scale package (CSP) the term ball is used.
Group Membership Brackets: Square brackets will be used to designate group
membership or to define a group of signals with similar function (i.e. A[21:1], SR[4:1])
Set: When referring to registers, the term set means the bit is a logical 1.
Clear: When referring to registers, the term clear means the bit is a logical 0.
Block: A group of bits (or words) that erase simultaneously with one block erase
instruction.
Main Block: A block that contains 32 Kwords.
Parameter Block: A block that contains 4 Kwords.
C3 Discrete
March 2008
290645-24