HPMD7904TR1 Avago Technologies US Inc., HPMD7904TR1 Datasheet - Page 10

HPMD7904TR1

Manufacturer Part Number
HPMD7904TR1
Description
Manufacturer
Avago Technologies US Inc.
Datasheet

Specifications of HPMD7904TR1

Pin Count
3
Screening Level
Commercial
Lead Free Status / Rohs Status
Not Compliant
10
Figure 23. Solder stencil details.
Table 1. Solder Compositions.
Alloy type
Sn42Bi58
Sn43Pb43Bi14
Sn63Pb37
Sn60Pb40
Sn91/Zn9
Sn96.2Ag2.5Cu0.8Sb0.5
Sn95.8Ag3.5Cu0.7
Sn96.5Ag3.5
Sn100
Sn95Sb5
Sn97Cu3
Solder Recommendations
The HPMD-7904 FBAR duplexer (and its variants) is
an assembly consisting of two LCC ceramic packages,
containing the Tx and Rx filters, mounted to a small
circuit board. Both packages on the circuit board are
mounted in place using Sn96.5/Ag3.5 solder (shaded
in Table 1).
Melting temp.
(
138
144 – 163
183
186
199
216
217
221
232
235
240
o
C)
Recommended working
temperature (
160 – 180
165 – 185
200 – 240
200 – 240
200 – 240
235 – 255
235 – 255
240 – 260
260 – 280
260 – 280
260 – 300
The recommended solder profile for the FBAR
duplexer is shown in Figure 16. Guidelines and a
typical profile are both shown. This typical profile
was tested on ten samples of the duplexer, each of
which was subjected to the profile six times without
effect upon the mechanical or electrical characteris-
tics of the device. Solder temperatures and times in
excess of those given in the guidelines of Table 1 may
result in damage to the duplexer or changes in its
characteristics.
o
C)
Comments
Lead free
Contains lead – some customers prohibit it.
Contains lead – some customers prohibit it.
Contains lead – some customers prohibit it.
May have oxidation problems
Popular lead free composition
Other alloy ratios are available
Used in the assembly of duplexers
Too hot – will melt the duplexer
Too hot – will melt the duplexer
Too hot – will melt the duplexer

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