BF1202WR NXP Semiconductors, BF1202WR Datasheet - Page 13
![Enhancement type Field-Effect Transistor in a plastic SOT343R package](/photos/40/57/405754/sot343r_sml.jpg)
BF1202WR
Manufacturer Part Number
BF1202WR
Description
Enhancement type Field-Effect Transistor in a plastic SOT343R package
Manufacturer
NXP Semiconductors
Datasheet
1.BF1202WR.pdf
(15 pages)
Specifications of BF1202WR
Application
VHF/UHF
Channel Type
N
Channel Mode
Enhancement
Continuous Drain Current
0.03A
Drain Source Voltage (max)
10V
Power Gain (typ)@vds
34.5@5VdB
Noise Figure (max)
11dB
Package Type
CMPAK
Pin Count
3 +Tab
Input Capacitance (typ)@vds
1.7@5V@Gate 1/1@5V@Gate 2pF
Output Capacitance (typ)@vds
0.85@5VpF
Reverse Capacitance (typ)
0.015@5VpF
Operating Temp Range
-65C to 150C
Mounting
Surface Mount
Number Of Elements
1
Power Dissipation (max)
200mW
Screening Level
Military
Lead Free Status / Rohs Status
Compliant
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
BF1202WR
Manufacturer:
NXP
Quantity:
120 000
Company:
Part Number:
BF1202WR
Manufacturer:
PHILIPS
Quantity:
12 458
Part Number:
BF1202WR
Manufacturer:
NXP/恩智浦
Quantity:
20 000
NXP Semiconductors
DATA SHEET STATUS
Notes
1. Please consult the most recently issued document before initiating or completing a design.
2. The product status of device(s) described in this document may have changed since this document was published
DISCLAIMERS
Limited warranty and liability Information in this
document is believed to be accurate and reliable.
However, NXP Semiconductors does not give any
representations or warranties, expressed or implied, as to
the accuracy or completeness of such information and
shall have no liability for the consequences of use of such
information.
In no event shall NXP Semiconductors be liable for any
indirect, incidental, punitive, special or consequential
damages (including - without limitation - lost profits, lost
savings, business interruption, costs related to the
removal or replacement of any products or rework
charges) whether or not such damages are based on tort
(including negligence), warranty, breach of contract or any
other legal theory.
Notwithstanding any damages that customer might incur
for any reason whatsoever, NXP Semiconductors’
aggregate and cumulative liability towards customer for
the products described herein shall be limited in
accordance with the Terms and conditions of commercial
sale of NXP Semiconductors.
Right to make changes NXP Semiconductors
reserves the right to make changes to information
published in this document, including without limitation
specifications and product descriptions, at any time and
without notice. This document supersedes and replaces all
information supplied prior to the publication hereof.
Suitability for use NXP Semiconductors products are
not designed, authorized or warranted to be suitable for
use in life support, life-critical or safety-critical systems or
equipment, nor in applications where failure or malfunction
of an NXP Semiconductors product can reasonably be
expected to result in personal injury, death or severe
2010 Sep 16
Objective data sheet
Preliminary data sheet
Product data sheet
N-channel dual-gate PoLo MOS-FETs
and may differ in case of multiple devices. The latest product status information is available on the Internet at
URL http://www.nxp.com.
DOCUMENT
STATUS
(1)
Development
Qualification
Production
PRODUCT
STATUS
(2)
This document contains data from the objective specification for product
development.
This document contains data from the preliminary specification.
This document contains the product specification.
13
property or environmental damage. NXP Semiconductors
accepts no liability for inclusion and/or use of NXP
Semiconductors products in such equipment or
applications and therefore such inclusion and/or use is at
the customer’s own risk.
Applications Applications that are described herein for
any of these products are for illustrative purposes only.
NXP Semiconductors makes no representation or
warranty that such applications will be suitable for the
specified use without further testing or modification.
Customers are responsible for the design and operation of
their applications and products using NXP
Semiconductors products, and NXP Semiconductors
accepts no liability for any assistance with applications or
customer product design. It is customer’s sole
responsibility to determine whether the NXP
Semiconductors product is suitable and fit for the
customer’s applications and products planned, as well as
for the planned application and use of customer’s third
party customer(s). Customers should provide appropriate
design and operating safeguards to minimize the risks
associated with their applications and products.
NXP Semiconductors does not accept any liability related
to any default, damage, costs or problem which is based
on any weakness or default in the customer’s applications
or products, or the application or use by customer’s third
party customer(s). Customer is responsible for doing all
necessary testing for the customer’s applications and
products using NXP Semiconductors products in order to
avoid a default of the applications and the products or of
the application or use by customer’s third party
customer(s). NXP does not accept any liability in this
respect.
BF1202; BF1202R; BF1202WR
DEFINITION
Product specification