ISL5216KI-1 Intersil, ISL5216KI-1 Datasheet - Page 49

• Manufacturer Part Number: ISL5216KI-1
• Description: Digital Down Converter 196-Pin BGA
• Manufacturer: Intersil

Specifications of ISL5216KI-1

• Package: 196BGA
• Operating Temperature: -40 to 85 °C

Absolute Maximum Ratings
Supply Voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4.6V
Core Supply Voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3.5V
Input, Output or I/O Voltage . . . . . . . . . . . . GND -0.5V to V
ESD Classification . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Class I
Operating Conditions
Voltage Range (I/O) . . . . . . . . . . . . . . . . . . . . . . +3.135V to +3.465V
Voltage Range (core) . . . . . . . . . . . . . . . . . . . . .+2.375V to +2.625V
Temperature Range
Input Low Voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 0V to +0.8V
Input High Voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . .2V to I/O V
CAUTION: Stresses above those listed in “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress only rating and operation of the
device at these or any other conditions above those indicated in the operational sections of this specification is not implied
NOTE:
21. θ
Electrical Specifications
NOTES:
22. Power Supply current is proportional to frequency of operation and programmed configuration of the part. Typical rating for I
23. Capacitance: T
Logical One Input Voltage
Logical Zero Input Voltage
Output High Voltage
Output Low Voltage
Input Leakage Current
Output Leakage Current
Typical Leakage Current
Standby Power Supply Current
-- Core
Standby Power Supply Current
-- IO’s
Operating Power Supply
Current -- Core
Operating Power Supply
Current -- IO’s
Operating Power Supply
Current -- Typical
Input Capacitance
Output Capacitance
Industrial. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .-40°C to +85°C
TB379 for details.
7.125mA/MHz @ 80MHz, full utilization.
process or design changes.
JA
is measured with the component mounted on a high effective thermal conductivity test board in free air or with the airflow. See Tech Brief
PARAMETER
A
= +25°C, controlled via design or process parameters and not directly tested. Characterized upon initial design and at major
49
I
I
I
CCOP-TYP
SYMBOL
I
I
CCOP-CR
CCSB-CR
CCOP-IO
V
CCSB-IO
I
C
O-TYP
CC1
V
V
V
C
V
OUT
I
OH
OL
I
O
IH
IN
IL
I
= Core Supply: 2.5V ± 0.125V, V
V
V
I
I
V
V
V
V
No CLK
V
No CLK
f = 80MHz, V
V
f = 80MHz, V
V
f = 80MHz, V
V
Freq = 1MHz, V
measurements are referenced to device
ground
OH
OL
CC2
CC2
IN
IN
IN
CC1
CC1
CC1
CC1
CC1
= 2mA, V
= V
= V
= V
= -2mA, V
= 3.465V
= 3.135V
= 2.625V, Outputs Not Loaded,
= 2.625V, Outputs Not Loaded,
= 2.625V, C
= 2.625V, C
= 2.625V, C
CC2
CC2
CC2
TEST CONDITIONS
CC
or GND, V
or GND, V
or GND, V
IN
IN
IN
CC2
+0.5V
CC2
= V
= V
= V
CC
CC
= 3.135V
L
L
L
ISL5216
= 3.135V
CC1
CC1
CC1
open, all
= 40pF
= 40pF
= 40pF
CC2
CC2
CC2
or GND,
or GND,
or GND,
CC2
= 3.465V
= 3.465V
= 3.465V
Thermal Information
Thermal Resistance (Typical, Note 21))
Maximum Junction Temperature . . . . . . . . . . . . . . . . . . . . . . +125°C
Maximum Storage Temperature Range . . . . . . . . . .-65°C to +150°C
Maximum Lead Temperature (Soldering 10s) . . . . . . . . . . . . +300°C
= I/O Supply: 3.3 ± 0.165V , T
196 Lead BGA Package (0.8 mm pitch). . . . . . . . . .
w/200 LFM Air Flow . . . . . . . . . . . . . . . . . . . . . . . . .
w/400 LFM Air Flow . . . . . . . . . . . . . . . . . . . . . . . . .
196 Lead BGA Package (1.0 mm pitch). . . . . . . . . .
w/200 LFM Air Flow . . . . . . . . . . . . . . . . . . . . . . . . .
w/400 LFM Air Flow . . . . . . . . . . . . . . . . . . . . . . . . .
MIN
-10
-10
2.0
2.6
-
-
-
-
-
-
-
-
-
-
TYP
570
± 2
A
-
-
-
-
-
-
-
-
-
-
-
-
= -40°C to +85°C, Industrial
MAX
700
0.8
0.4
0.5
10
10
50
8
5
5
-
-
-
-
CCOP
(Note 22)
(Note 23)
(Note 23)
is
θ
UNITS
July 13, 2007
JA
mA
mA
mA
mA
mA
μA
μA
μA
pF
pF
V
V
V
V
FN6013.3
(°C/W)
30
27
26
29
26
25