M25P80-VMN6TP Micron Technology Inc, M25P80-VMN6TP Datasheet - Page 54

• Manufacturer Part Number: M25P80-VMN6TP
• Manufacturer: Micron Technology Inc

Specifications of M25P80-VMN6TP

• Cell Type: NOR
• Density: 8Mb
• Access Time (max): 8ns
• Interface Type: Serial (SPI)
• Boot Type: Not Required
• Address Bus: 1b
• Operating Supply Voltage (typ): 3.3V
• Operating Temp Range: -40C to 85C
• Package Type: SOIC N
• Program/erase Volt (typ): 2.7 to 3.6V
• Sync/async: Synchronous
• Operating Temperature Classification: Industrial
• Operating Supply Voltage (min): 2.7V
• Operating Supply Voltage (max): 3.6V
• Word Size: 8b
• Number Of Words: 1M
• Supply Current: 8mA
• Mounting: Surface Mount
• Pin Count: 8
• Lead Free Status / Rohs Status: Compliant

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Revision history
Table 24.
07-May-2004
18-May-2004
27-Sep-2002
13-Dec-2002
24-Nov-2003
05-Aug-2004
01-Aug-2005
24-Apr-2002
24-Oct-2003
21-Apr-2004
20-Oct-2005
13-Apr-2006
20-Jul-2006
Date
Document revision history
Revision
1.0
1.1
1.2
2.0
2.1
3.0
4.0
5.0
6.0
7.0
8.0
10
9
Document released as a Product Preview data sheet
Clarification of descriptions of entering Standby Power mode from Deep
Power-down mode, and of terminating an instruction sequence or data-out
sequence.
VFQFPN8 package (MLP8) added. Order code (MW) corrected on page 1
for SO8 package. Document promoted to Preliminary Data.
Typical Page Program time improved. Write Protect setup and hold times
specified, for applications that switch Write Protect to exit the Hardware
Protection mode immediately before a WRSR, and to enter the Hardware
Protection mode again immediately after.
Table of contents, warning about exposed paddle on MLP8, and Pb-free
options added.
40MHz AC Characteristics table included as well as 25MHz. Change of
naming for VDFPN8 package. Document promoted to full datasheet
Improvement to description of reading the 8-bit electronic signature.
SO16 package added. SO8W package removed. Soldering temperature
information clarified for RoHS compliant devices. Device Grade clarified
Automotive range added
SO8W package re-instated, but under limited availability
Data-retention measurement temperature corrected. Details of how to find
the date of marking added.
Updated Page Program (PP) instructions in
Program
SO16 package removed. All packages are RoHS compliant. MLP8
package renamed as VFQFPN8. Plating technology clarified in
Ordering information
silhouette
Device grade 3 specifications removed from datasheet. Data retention
conditions changed in
Figure 3: Bus Master and memory devices on the SPI bus
Note 2
Note 2
Note on SO8 package removed below
scheme.
SO8N package added (see
added.
added below
(PP),
on page
Instruction times
1). t
Figure 26
scheme. VFQFPN silhouette modified (see
Table 11: Data retention and
SHQZ
Figure 28
timing modified in
and
Changes
and
Note 2
Instruction Times (Device Grade
and
Table 22: Ordering information
Table
added below
Page
Figure 25: Output
19).
Programming,
endurance.
Figure
modified and
27.
Table 22:
Page
timing.
3).