KMPC8548EVTAUJC Freescale Semiconductor, KMPC8548EVTAUJC Datasheet - Page 87

• Manufacturer Part Number: KMPC8548EVTAUJC
• Manufacturer: Freescale Semiconductor

Specifications of KMPC8548EVTAUJC

• Lead Free Status / Rohs Status: Supplier Unconfirmed

18 Package Description
This section details package parameters, pin assignments, and dimensions.
18.1
The package parameters for both the HiCTE FC-CBGA and FC-PBGA are as provided in
18.2
Figure 55
HiCTE FC-CBGA and FC-PBGA package with full lid.
Freescale Semiconductor
Package outline
Interconnects
Ball pitch
Ball diameter (typical)
Solder ball
Solder ball (lead-free)
Notes:
1. The HiCTE FC-CBGA package is available on only Version 2.0 of the device.
2. The FC-PBGA package is available on only Version 2.1.1 and 2.1.2 of the device.
Package Parameters
Mechanical Dimensions of the HiCTE FC-CBGA and FC-PBGA
with Full Lid
shows the mechanical dimensions and bottom surface nomenclature for both the MPC8548E
Parameter
MPC8548E PowerQUICC III Integrated Processor Hardware Specifications, Rev. 7
Table 66. Package Parameters
29 mm × 29 mm
4.5% Ag
0.5% Cu
62% Sn
36% Pb
95% Sn
CBGA
0.6 mm
2% Ag
1 mm
783
1
29 mm × 29 mm
96.5% Sn
3.5% Ag
62% Sn
36% Pb
PBGA
0.6 mm
2% Ag
1 mm
783
Package Description
Table
2
66.
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