SC16IS760IPW,112 NXP Semiconductors, SC16IS760IPW,112 Datasheet - Page 3

• Manufacturer Part Number: SC16IS760IPW,112
• Description: IC UART 64BYTE 24TSSOP
• Manufacturer: NXP Semiconductors
• Type: IrDA or RS- 232 or RS- 485r

Specifications of SC16IS760IPW,112

• Number Of Channels: 1, UART
• Package / Case: 24-TSSOP (0.173", 4.40mm Width)
• Features: Low Current
• Fifo's: 64 Byte
• Protocol: RS232, RS485
• Voltage - Supply: 2.5V, 3.3V, 5V
• With Auto Flow Control: Yes
• With False Start Bit Detection: Yes
• With Modem Control: Yes
• Mounting Type: Surface Mount
• Data Rate: 5 Mbps
• Supply Voltage (max): 3.6 V
• Supply Voltage (min): 2.3 V
• Supply Current: 6 mA
• Maximum Operating Temperature: + 85 C
• Minimum Operating Temperature: - 40 C
• Mounting Style: SMD/SMT
• Operating Supply Voltage: 2.5 V or 3.3 V
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• For Use With: 568-4000 - DEMO BOARD SPI/I2C TO DUAL UART568-3510 - DEMO BOARD SPI/I2C TO UART
• Lead Free Status / Rohs Status: Lead free / RoHS Compliant
• Other names: 568-4185; 935279287112; SC16IS760IPW; SC16IS760IPW

NXP Semiconductors
4. Ordering information
Table 1.
SC16IS740_750_760_6
Product data sheet
Type number
SC16IS740IPW
SC16IS750IBS
SC16IS750IPW
SC16IS760IBS
SC16IS760IPW
Ordering information
Package
Name
TSSOP16
HVQFN24
TSSOP24
HVQFN24
TSSOP24
Description
plastic thin shrink small outline package; 16 leads; body width 4.4 mm
plastic thermal enhanced very thin quad flat package; no leads;
24 terminals; body 4
plastic thin shrink small outline package; 24 leads; body width 4.4 mm
plastic thermal enhanced very thin quad flat package; no leads;
24 terminals; body 4
plastic thin shrink small outline package; 24 leads; body width 4.4 mm
Single UART with I
Rev. 06 — 13 May 2008
4
4
0.85 mm
0.85 mm
2
C-bus/SPI interface, 64-byte FIFOs, IrDA SIR
SC16IS740/750/760
© NXP B.V. 2008. All rights reserved.
Version
SOT403-1
SOT616-3
SOT355-1
SOT616-3
SOT355-1
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