STP16CPC26MTR STMicroelectronics, STP16CPC26MTR Datasheet - Page 4
![no-image](/images/manufacturer_photos/0/6/637/stmicroelectronics_sml.jpg)
STP16CPC26MTR
Manufacturer Part Number
STP16CPC26MTR
Description
Manufacturer
STMicroelectronics
Datasheet
1.STP16CPC26MTR.pdf
(27 pages)
Specifications of STP16CPC26MTR
Lead Free Status / Rohs Status
Supplier Unconfirmed
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Electrical ratings
2
2.1
2.2
4/27
Electrical ratings
Absolute maximum ratings
Stressing the device above the rating listed in the “absolute maximum ratings” table may
cause permanent damage to the device. These are stress ratings only and operation of the
device at these or any other conditions above those indicated in the operating sections of
this specification is not implied. Exposure to absolute maximum rating conditions for
extended periods may affect device reliability.
Table 3.
Thermal data
Table 4.
1. According with JEDEC standard 51-7B
2. The exposed pad should be soldered directly to the PCB to realize the thermal benefits.
Symbol
Symbol
T
R
T
I
ESD
V
f
GND
V
CLK
OPR
T
STG
I
V
thJA
DD
O
O
A
I
Supply voltage
Output voltage
Output current
Input voltage
GND terminal current
Electrostatic discharge protection HBM human
body model
Clock frequency
Operating free-air temperature range
Operating temperature range
Storage temperature range
Thermal resistance junction-case
(1)
Absolute maximum ratings
Thermal data
Parameter
Parameter
Doc ID 18469 Rev 2
TSSOP24
TSSOP24
QSOP24
SO-24
(2)
-0.4 to V
-40 to +125
-40 to +150
-55 to +150
-0.5 to 20
Value
Value
0 to 7
1600
37.5
90
±2
50
60
85
72
DD
+0.4
STP16CPC26
°C/W
MHz
Unit
Unit
mA
mA
kV
°C
V
V
V