SA58672TK,138 NXP Semiconductors, SA58672TK,138 Datasheet - Page 27

• Manufacturer Part Number: SA58672TK,138
• Description: IC AMP AUDIO 3W MONO D 10HVSON
• Manufacturer: NXP Semiconductors
• Type: Class Dr

Specifications of SA58672TK,138

• Output Type: 1-Channel (Mono)
• Package / Case: 10-HVSON
• Max Output Power X Channels @ Load: 3W x 1 @ 4 Ohm
• Voltage - Supply: 2 V ~ 5.5 V
• Features: Differential Inputs, Short-Circuit and Thermal Protection, Shutdown
• Mounting Type: Surface Mount
• Product: Class-D
• Output Power: 3 W
• Common Mode Rejection Ratio (min): 69 dB
• Thd Plus Noise: 0.08 %
• Operating Supply Voltage: 3 V, 5 V
• Supply Current: 3.4 mA
• Maximum Power Dissipation: 3.12 mW
• Maximum Operating Temperature: + 85 C
• Mounting Style: SMD/SMT
• Audio Load Resistance: 8 Ohms
• Input Signal Type: Differential
• Minimum Operating Temperature: - 40 C
• Output Signal Type: Differential, Single
• Supply Type: Single
• Supply Voltage (max): 5.5 V
• Supply Voltage (min): 2 V
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant, Lead free / RoHS Compliant
• Other names: 935286769138; SA58672TK-T; SA58672TK-T

NXP Semiconductors
20. Contents
1
2
3
4
5
6
6.1
6.2
7
8
9
10
11
11.1
11.2
11.3
11.4
11.5
11.6
11.7
11.8
12
12.1
13
14
14.1
14.2
14.3
14.4
15
15.1
15.2
15.3
15.3.1
15.3.2
15.3.3
15.3.4
16
17
18
18.1
18.2
18.3
18.4
General description . . . . . . . . . . . . . . . . . . . . . . 1
Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2
Ordering information . . . . . . . . . . . . . . . . . . . . . 2
Block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . 2
Pinning information . . . . . . . . . . . . . . . . . . . . . . 3
Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 4
Static characteristics. . . . . . . . . . . . . . . . . . . . . 5
Dynamic characteristics . . . . . . . . . . . . . . . . . . 6
Typical characterization curves . . . . . . . . . . . . 7
Application information. . . . . . . . . . . . . . . . . . 13
Test information . . . . . . . . . . . . . . . . . . . . . . . . 17
Package outline . . . . . . . . . . . . . . . . . . . . . . . . 18
Soldering of SMD packages . . . . . . . . . . . . . . 20
Soldering of WLCSP packages. . . . . . . . . . . . 22
Abbreviations . . . . . . . . . . . . . . . . . . . . . . . . . . 24
Revision history . . . . . . . . . . . . . . . . . . . . . . . . 25
Legal information. . . . . . . . . . . . . . . . . . . . . . . 26
Pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3
Pin description . . . . . . . . . . . . . . . . . . . . . . . . . 4
Power supply decoupling considerations . . . . 13
Voltage gain . . . . . . . . . . . . . . . . . . . . . . . . . . 13
Input capacitor selection . . . . . . . . . . . . . . . . . 13
PCB layout considerations . . . . . . . . . . . . . . . 14
Evaluation demo board. . . . . . . . . . . . . . . . . . 14
Filter-free operation and ferrite bead filters. . . 15
Efficiency and thermal considerations . . . . . . 16
Additional thermal information . . . . . . . . . . . . 16
Test setup for typical characterization curves . 17
Introduction to soldering . . . . . . . . . . . . . . . . . 20
Wave and reflow soldering . . . . . . . . . . . . . . . 20
Wave soldering . . . . . . . . . . . . . . . . . . . . . . . . 20
Reflow soldering . . . . . . . . . . . . . . . . . . . . . . . 21
Introduction to soldering WLCSP packages . . 22
Board mounting . . . . . . . . . . . . . . . . . . . . . . . 22
Reflow soldering . . . . . . . . . . . . . . . . . . . . . . . 22
Stand off . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23
Quality of solder joint . . . . . . . . . . . . . . . . . . . 24
Rework . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24
Cleaning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24
Data sheet status . . . . . . . . . . . . . . . . . . . . . . 26
Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . 26
Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . 26
Trademarks . . . . . . . . . . . . . . . . . . . . . . . . . . . 26
19
20
Please be aware that important notices concerning this document and the product(s)
described herein, have been included in section ‘Legal information’.
© NXP B.V. 2009.
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: [e-mail]
Contact information . . . . . . . . . . . . . . . . . . . . 26
Contents. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 27
3.0 W mono class-D audio amplifier
Document identifier: SA58672_4
SA58672
Date of release: 8 June 2009
All rights reserved.