TDA8922CTH/N1,118 NXP Semiconductors, TDA8922CTH/N1,118 Datasheet
TDA8922CTH/N1,118
Specifications of TDA8922CTH/N1,118
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TDA8922CTH/N1,118 Summary of contents
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TDA8922C 2 Rev. 01 — 7 September 2009 1. General description The TDA8922C is a high-efficiency Class D audio power amplifier. Typical output power with a speaker load impedance The TDA8922C is available ...
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... NXP Semiconductors 4. Quick reference data Table 1. Quick reference data Symbol Parameter General V supply voltage DD V negative supply voltage SS V overvoltage protection threshold th(ovp) voltage I total quiescent current q(tot) Stereo single-ended configuration P output power o Mono bridge-tied load configuration P output power ...
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... NXP Semiconductors 6. Block diagram VDDA n.c. 3 (20) 10 (4) 9 (3) IN1M INPUT 8 (2) STAGE IN1P mute 11 (5) n.c. 7 (1) OSC OSCILLATOR 6 (23) MODE MODE 2 (19) SGND mute 5 (22) IN2P INPUT 4 (21) STAGE IN2M 1 (18) 12 (6) VSSA n.c. Pin numbers in brackets refer to type number TDA8922CJ. ...
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... NXP Semiconductors 7. Pinning information 7.1 Pinning VSSD 24 23 VDDP2 BOOT2 22 OUT2 21 VSSP2 20 19 n.c. TDA8922CTH STABI 18 VSSP1 17 16 OUT1 15 BOOT1 VDDP1 14 PROT 13 Fig 2. Pin configuration TDA8922CTH TDA8922C_1 Product data sheet 1 VSSA 2 SGND 3 VDDA 4 IN2M 5 IN2P 6 MODE 7 OSC 8 IN1P 9 IN1M 10 n.c. ...
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... NXP Semiconductors 7.2 Pin description Table 3. Symbol VSSA SGND VDDA IN2M IN2P MODE OSC IN1P IN1M n.c. n.c. n.c. PROT VDDP1 BOOT1 OUT1 VSSP1 STABI n.c. VSSP2 OUT2 BOOT2 VDDP2 VSSD 8. Functional description 8.1 General The TDA8922C is a two-channel audio power amplifier that uses Class D technology. ...
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... NXP Semiconductors The TDA8922C single-chip Class D amplifier contains high-power switches, drivers, timing and handshaking between the power switches, along with some control logic. To ensure maximum system robustness, an advanced protection strategy has been implemented to provide overvoltage, overtemperature and overcurrent protection. Each of the two audio channels contains a PWM modulator, an analog feedback loop and a differential input stage ...
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... NXP Semiconductors To ensure the coupling capacitors at the inputs (C the outputs start switching, a delay is inserted during the transition from Mute to Operating mode. An overview of the start-up timing is provided in (1) First Fig 5. TDA8922C_1 Product data sheet V MODE duty cycle > 4.2 V 2.1 V < V < 2.9 V ...
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... NXP Semiconductors 8.2 Pulse-width modulation frequency The amplifier output signal is a PWM signal with a typical carrier frequency of between 250 kHz and 450 kHz. A second order LC demodulation filter on the output converts the PWM signal into an analog audio signal. The carrier frequency is determined by an external resistor, R frequency setting is between 250 kHz and 450 kHz ...
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... NXP Semiconductors TFB is specified at the thermal foldback activation temperature T closed-loop voltage gain is reduced by 6 dB. The TFB range is: T act(th_fold) The value of T details. 8.3.1.2 OverTemperature Protection (OTP) If TFB fails to stabilize the temperature and the junction temperature continues to rise, the amplifier will shut down as soon as the temperature reaches the thermal protection ...
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... NXP Semiconductors • Short-circuit impedance < Z and at the same time discharges the capacitor on pin PROT. When C discharged, the amplifier shuts down completely and an internal timer is started. The value of the protection capacitor ( and 220 pF (typically 47 pF). While OCP is activated, an internal current source is ...
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... NXP Semiconductors Start-up will be interrupted If a short-circuit is detected between one of the output terminals and pin VDDP1/VDDP2 or VSSP1/VSSP2. The TDA8922C will wait until the short-circuit to the supply lines has been removed before resuming start-up. The short circuit will not generate large currents because the short-circuit check is carried out before the power stages are enabled. • ...
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... NXP Semiconductors • Stereo operation: to avoid acoustical phase differences, the inputs should be in anti-phase and the speakers should be connected in anti-phase. This configuration: – minimizes power supply peak current – minimizes supply pumping effects, especially at low audio frequencies • Mono BTL operation: the inputs must be connected in anti-parallel. The output of one channel is inverted and the speaker load is connected between the two outputs of the TDA8922C ...
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... NXP Semiconductors 10. Thermal characteristics Table 7. Symbol R th(j-a) R th(j-c) 11. Static characteristics Table 8. Static characteristics 350 kHz osc Symbol Parameter Supply V supply voltage DD V negative supply voltage SS V overvoltage protection threshold th(ovp) voltage V undervoltage protection threshold th(uvp) voltage V unbalance protection threshold voltage th(ubp) ...
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... NXP Semiconductors Table 8. Static characteristics 350 kHz osc Symbol Parameter T thermal foldback activation act(th_fold) temperature [ the supply voltage on pins VDDP1, VDDP2 and VDDA the supply voltage on pins VSSP1, VSSP2, VSSA and VSSD. SS [3] Unbalance protection activated when V [4] With respect to SGND (0 V). ...
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... NXP Semiconductors Table 9. Dynamic characteristics unless otherwise specified amb Symbol Parameter Z input impedance i C input capacitance i t input rise time r(i) [1] When using an external oscillator, the frequency f kHz minimum, 450 kHz maximum) due to the internal clock divider; see [2] When t > 100 ns, the output noise floor will increase. ...
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... NXP Semiconductors [ the series resistance of the low-pass LC filter inductor used in the application. s(L) [2] Output power is measured indirectly; based on R [3] THD measured between 22 Hz and 20 kHz, using AES17 20 kHz brick wall filter; max. limit is guaranteed but may not be 100 % tested. [ (p-p); measured independently between VDDPn and SGND and between VSSPn and SGND. ...
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... NXP Semiconductors 13. Application information 13.1 Mono BTL application When using the power amplifi mono BTL application, the inputs of the two channels must be connected in anti-parallel and the phase of one of the inputs must be inverted; (see Figure two single-ended demodulation filters. 13.2 Pin MODE To ensure a pop noise-free start-up time-constant must be applied to pin MODE ...
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... NXP Semiconductors 13.3.2 Bridge-Tied Load (BTL) Maximum output power 0.5% Maximum output current internally limited peak Where: • P o(0.5 %) • load impedance L • R DSon(hs) • R DSon(ls) • R s(L) • single-sided supply voltage or 0.5 P • t w(min) • f osc Remark: Note that I the current through the load and the ripple current. The value of the ripple current is dependent on the coil inductance and the voltage drop across the coil ...
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... NXP Semiconductors Equation 5 of TFB and total thermal resistance from junction to ambient. Power dissipation (P) is determined by the efficiency of the TDA8922C. Efficiency measured as a function of output power is given in derived as a function of output power as shown in (1) R (2) R (3) R (4) R (5) R Fig 9. TDA8922C_1 Product data sheet defi ...
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... NXP Semiconductors In the following example, a heatsink calculation is made for supply: The audio signal has a crest factor of 10 (the ratio between peak power and average power (20 dB)); this means that the average output power is Thus, the peak RMS output power level is the 0.5 % THD level, i.e. 110 W. ...
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... NXP Semiconductors The most effective way to avoid pumping effects is to connect the TDA8922C in a mono full-bridge configuration. In the case of stereo single-ended applications advised to connect the inputs in anti-phase (see be adapted; for example, by increasing the values of the supply line decoupling capacitors. 13.7 Application schematic Notes on the application schematic: • ...
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R VDDA VDDA 10 VDDP VDDP C VDDP 470 GND VSSP 470 F VSSP VSSP R VSSA operating VSSA 10 n.c. n.c. n. IN1P 2 470 nF IN1 ...
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... NXP Semiconductors 13.8 Curves measured in reference design (demonstration board) THD+N (%) (1) f (2) f (3) f Fig 11. THD + function of output power, SE configuration with 2 THD+N (%) (1) f (2) f (3) f Fig 12. THD + function of output power, SE configuration with 2 TDA8922C_1 Product data sheet 350 kHz (external oscillator), 2 ...
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... NXP Semiconductors THD+N (%) (1) f (2) f (3) f Fig 13. THD + function of output power, BTL configuration with 1 THD+N (%) (1) P (2) P Fig 14. THD + function of frequency, SE configuration with 2 TDA8922C_1 Product data sheet 350 kHz (external oscillator osc = 6 kHz kHz 100 350 kHz (external oscillator), 2 ...
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... NXP Semiconductors THD+N (%) (1) P (2) P Fig 15. THD + function of frequency, SE configuration with 2 THD+N (%) (1) P (2) P Fig 16. THD + function of frequency, BTL configuration with 1 TDA8922C_1 Product data sheet ( ( 350 kHz (external oscillator osc = ( ( 350 kHz (external oscillator osc = Rev. 01 — 7 September 2009 ...
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... NXP Semiconductors (dB) Fig 17. Channel separation as a function of frequency, SE configuration with 2 (dB) Fig 18. Channel separation as a function of frequency, SE configuration with 2 TDA8922C_1 Product data sheet 100 350 kHz (external oscillator osc 1 W and 10 W respectively 100 350 kHz (external oscillator osc 1 W and 10 W respectively. Rev. 01 — ...
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... NXP Semiconductors P (W (1) 2 (2) 2 (3) 1 Fig 19. Power dissipation as a function of output power per channel, SE configuration (1) 2 (2) 2 (3) 1 Fig 20. Efficiency as a function of output power per channel, SE configuration TDA8922C_1 Product data sheet kHz 350 kHz (external oscillator). i osc 6 SE confi ...
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... NXP Semiconductors P (W) (1) THD + (2) THD + (3) THD + (4) THD + Fig 21. Output power as a function of supply voltage, SE configuration P (W) (1) THD + (2) THD + Fig 22. Output power as a function of supply voltage, BTL configuration TDA8922C_1 Product data sheet 100 12.5 17.5 12.5 17.5 Infi ...
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... NXP Semiconductors Gv(cl) (dB) (1) 1 (2) 2 (3) 2 Fig 23. Closed-loop voltage gain as a function of frequency SVRR (dB) (1) Operating mode. (2) Mute mode. (3) Standby mode. Fig 24. SVRR as a function of ripple frequency, ripple on V TDA8922C_1 Product data sheet 350 kHz (external oscillator osc 8 BTL configuration; L ...
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... NXP Semiconductors SVRR (dB) (1) Mute mode. (2) Operating mode. (3) Standby mode. Fig 25. SVRR as a function of ripple frequency, ripple on V SVRR (dB) (1) Operating mode. (2) Mute mode. (3) Standby mode. Fig 26. SVRR as a function of ripple frequency, ripple on V TDA8922C_1 Product data sheet 20 60 100 140 ...
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... NXP Semiconductors SVRR (dB) (1) Operating mode. (2) Mute mode. (3) Standby mode. Fig 27. SVRR as a function of ripple frequency, ripple (V) (1) Mode voltage down. (2) Mode voltage up. Fig 28. Output voltage as a function of mode voltage TDA8922C_1 Product data sheet 120 Ripple short on input pins (p-p ripple ...
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... NXP Semiconductors mute (dB) (1) 2 (2) 2 Fig 29. Mute attenuation as a function of frequency TDA8922C_1 Product data sheet 350 kHz (external oscillator osc 6 SE configuration configuration. Rev. 01 — 7 September 2009 TDA8922C class-D power amplifier 010aaa581 (1) ( (Hz (RMS). i © NXP B.V. 2009. All rights reserved. ...
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... NXP Semiconductors 14. Package outline DBS23P: plastic DIL-bent-SIL power package; 23 leads (straight lead length 3.2 mm DIMENSIONS (mm are the original dimensions) (1) UNIT 4.6 1.15 1.65 0.75 0.55 30.4 mm 4.3 0.85 1.35 0.60 0.35 29.9 Note 1. Plastic or metal protrusions of 0.25 mm maximum per side are not included. ...
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... NXP Semiconductors HSOP24: plastic, heatsink small outline package; 24 leads; low stand-off height pin 1 index DIMENSIONS (mm are the original dimensions) A (1) UNIT max. 0.08 0.53 3.5 mm 3.5 0.35 0.04 0.40 3.2 Notes 1. Limits per individual lead. 2. Plastic or metal protrusions of 0.25 mm maximum per side are not included. ...
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... NXP Semiconductors 15. Soldering of SMD packages This text provides a very brief insight into a complex technology. A more in-depth account of soldering ICs can be found in Application Note AN10365 “Surface mount reflow soldering description” . 15.1 Introduction to soldering Soldering is one of the most common methods through which packages are attached to Printed Circuit Boards (PCBs), to form electrical circuits ...
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... NXP Semiconductors 15.4 Reflow soldering Key characteristics in reflow soldering are: • Lead-free versus SnPb soldering; note that a lead-free reflow process usually leads to higher minimum peak temperatures (see reducing the process window • Solder paste printing issues including smearing, release, and adjusting the process window for a mix of large and small components on one board • ...
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... NXP Semiconductors Fig 32. Temperature profiles for large and small components For further information on temperature profiles, refer to Application Note AN10365 “Surface mount reflow soldering description” . 16. Soldering of through-hole mount packages 16.1 Introduction to soldering through-hole mount packages This text gives a very brief insight into wave, dip and manual soldering. ...
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... NXP Semiconductors 16.4 Package related soldering information Table 14. Package CPGA, HCPGA DBS, DIP, HDIP, RDBS, SDIP, SIL [2] PMFP [1] For SDIP packages, the longitudinal axis must be parallel to the transport direction of the printed-circuit board. [2] For PMFP packages hot bar soldering or manual soldering is suitable. ...
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... Right to make changes — NXP Semiconductors reserves the right to make changes to information published in this document, including without limitation specifications and product descriptions, at any time and without notice ...
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... NXP Semiconductors 20. Contents 1 General description . . . . . . . . . . . . . . . . . . . . . . 1 2 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 3 Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 4 Quick reference data . . . . . . . . . . . . . . . . . . . . . 2 5 Ordering information . . . . . . . . . . . . . . . . . . . . . 2 6 Block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . 3 7 Pinning information . . . . . . . . . . . . . . . . . . . . . . 4 7.1 Pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4 7.2 Pin description . . . . . . . . . . . . . . . . . . . . . . . . . 5 8 Functional description . . . . . . . . . . . . . . . . . . . 5 8.1 General . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5 8.2 Pulse-width modulation frequency . . . . . . . . . . 8 8.3 Protection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8 8.3.1 Thermal protection . . . . . . . . . . . . . . . . . . . . . . 8 8 ...