TDA8920BTH/N2,118 NXP Semiconductors, TDA8920BTH/N2,118 Datasheet
TDA8920BTH/N2,118
Specifications of TDA8920BTH/N2,118
935275344118
TDA8920BTH-T
TDA8920BTH/N2,518
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TDA8920BTH/N2,118 Summary of contents
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TDA8920B 2 Rev. 02 — 07 November 2005 1. General description The TDA8920B is a high efficiency class-D audio power amplifier with very low dissipation. The typical output power is 2 The device is available in the HSOP24 power package ...
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Philips Semiconductors 4. Quick reference data Table 1: Symbol Parameter General q(tot) Stereo single-ended configuration P o Mono bridge-tied load configuration Ordering information Table 2: Type number TDA8920BTH TDA8920BJ TDA8920B_2 Product data sheet ...
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Philips Semiconductors 6. Block diagram V V DDA2 DDA1 3 (20) 10 (4) 9 (3) IN1M INPUT 8 (2) STAGE IN1P mute 11 (5) SGND1 7 (1) OSC OSCILLATOR 6 (23) MODE MODE 2 (19) SGND2 mute 5 (22) IN2P ...
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Philips Semiconductors 7. Pinning information 7.1 Pinning V 24 SSD 23 V DDP2 BOOT2 22 OUT2 SSP2 19 n.c. TDA8920BTH STABI SSP1 16 OUT1 BOOT1 DDP1 PROT 13 Fig 2. Pin ...
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Philips Semiconductors Table 3: Symbol Pin SGND1 V SSA1 PROT V DDP1 BOOT1 OUT1 V SSP1 STABI n.c. V SSP2 OUT2 BOOT2 V DDP2 V SSD 8. Functional description 8.1 General The TDA8920B is a two channel audio power amplifier ...
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Philips Semiconductors The amplifier system can be switched to one of three operating modes by pin MODE: • Standby mode; with a very low supply current • Mute mode; the amplifiers are operational; but the audio signal at the output ...
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Philips Semiconductors Fig 5. Timing on mode selection input TDA8920B_2 Product data sheet V mode 50 % duty cycle 4.2 V mute 2 mode standby 0 V (SGND) 100 ms V mode 50 % duty cycle ...
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Philips Semiconductors 8.2 Pulse width modulation frequency The output signal of the amplifi PWM signal with a carrier frequency of approximately 317 kHz. Using a 2nd-order LC demodulation filter in the application results in an analog audio signal ...
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Philips Semiconductors In case of an impedance drop (e.g. due to dynamic behavior of the loudspeaker) the same protection will be activated; the maximum output current is again limited but the amplifier will NOT switch-off completely (thus ...
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Philips Semiconductors 8.3.4 Supply voltage protections If the supply voltage drops below 12.5 V, the UnderVoltage Protection (UVP) circuit is activated and the system will shut-down correctly. If the internal clock is used, this switch-off will be silent and without ...
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Philips Semiconductors 8.4 Differential audio inputs For a high common mode rejection ratio and a maximum of flexibility in the application, the audio inputs are fully differential. By connecting the inputs anti-parallel the phase of one of the channels can ...
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Philips Semiconductors 10. Thermal characteristics Table 6: Symbol R th(j-a) R th(j-c) [1] See also 11. Static characteristics Table 7: Static characteristics 317 kHz unless otherwise specified. P osc amb ...
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Philips Semiconductors Table 7: Static characteristics 317 kHz unless otherwise specified. P osc amb Symbol Parameter Temperature protection T temperature protection activation prot T hysteresis of temperature protection hys [1] ...
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Philips Semiconductors 12.2 Stereo and dual SE application Table 9: Stereo and dual SE application characteristics kHz Symbol Parameter P output power o THD total ...
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Philips Semiconductors 12.3 Mono BTL application Table 10: Mono BTL application characteristics kHz Symbol Parameter P output power o THD total harmonic distortion G closed ...
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Philips Semiconductors 13.2 MODE pin For pop noise-free start- time-constant must be applied on the MODE pin. The bias-current setting of the VI-converter input is directly related to the voltage on the MODE pin. In turn the bias-current ...
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Philips Semiconductors If two or more class-D amplifiers are used in the same audio application strongly recommended that all devices run at the same switching frequency. This can be realized by connecting all OSC pins together and feed ...
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Philips Semiconductors (1) R (2) R (3) R (4) R (5) R Fig 8. Derating curves for power dissipation as a function of maximum ambient 13.6 Output current limiting To guarantee the robustness of the class-D amplifier the maximum output ...
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Philips Semiconductors A typical value for the capacitor on the PROT pin is 220 pF. After a fixed time of 100 ms the amplifier is switched on again. If the requested output current is still too high the amplifier will ...
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Philips Semiconductors 13.8 Application schematic Notes for the application schematic: • A solid ground plane around the switching amplifier is necessary to prevent emission • 100 nF capacitors must be placed as close as possible to the power supply pins ...
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L1 BEAD CON1 100 nF 47 F/35 V 470 F/ GND 100 nF 47 F/35 V 470 F/ BEAD ...
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Philips Semiconductors 13.9 Curves measured in reference design 2 10 (THD N)/S (%) configuration kHz. ...
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Philips Semiconductors 2 10 (THD N)/S (%) ( ( configuration out ( ...
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Philips Semiconductors 0 cs (dB (1) (2) 80 100 configuration out ( out Fig 18. ...
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Philips Semiconductors 200 P o (W) 160 120 kHz. ( BTL configuration. ( BTL configuration. ( configuration. ( configuration. Fig 22. ...
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Philips Semiconductors 0 SVRR (dB (1) 60 (2) 80 100 (p-p). P ripple (1) Both supply lines rippled. (2) One supply line rippled. Fig 26. ...
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Philips Semiconductors 15. Package outline HSOP24: plastic, heatsink small outline package; 24 leads; low stand-off height pin 1 index DIMENSIONS (mm are the original dimensions) A (1) UNIT ...
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Philips Semiconductors DBS23P: plastic DIL-bent-SIL power package; 23 leads (straight lead length 3.2 mm DIMENSIONS (mm are the original dimensions) (1) UNIT 4.6 1.15 1.65 ...
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Philips Semiconductors 16. Soldering 16.1 Introduction This text gives a very brief insight to a complex technology. A more in-depth account of soldering ICs can be found in our Data Handbook IC26; Integrated Circuit Packages (document order number 9398 652 ...
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Philips Semiconductors – for packages with a thickness – for packages with a thickness < 2.5 mm and a volume thick/large packages. • below 240 C (SnPb process) or below 260 C (Pb-free process) for packages with a thickness < ...
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Philips Semiconductors 16.4 Package related soldering information Table 11: Suitability of IC packages for wave, reflow and dipping soldering methods Mounting Package Through-hole mount CPGA, HCPGA DBS, DIP, HDIP, RDBS, SDIP, SIL [4] Through-hole-surface PMFP mount Surface mount BGA, HTSSON..T ...
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Philips Semiconductors 17. Revision history Table 12: Revision history Document ID Release date TDA8920B_2 20051107 • Modifications: In Section 9 “Limiting values” operating and non operating conditions (see TDA8920B_1 20041001 TDA8920B_2 Product data sheet Data sheet status Change notice Product ...
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Philips Semiconductors 18. Data sheet status [1] Level Data sheet status Product status I Objective data Development II Preliminary data Qualification III Product data Production [1] Please consult the most recently issued data sheet before initiating or completing a design. ...
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Philips Semiconductors 23. Contents 1 General description . . . . . . . . . . . . . . . . . . . . . . 1 2 Features . . . . . . . . ...