P28F001BX-T120 Intel Corporation, P28F001BX-T120 Datasheet

no-image

P28F001BX-T120

Manufacturer Part Number
P28F001BX-T120
Description
1-Mbit(128K x 8) boot block flash memory. Access speed 120 ns
Manufacturer
Intel Corporation
Datasheet

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
P28F001BX-T120
Manufacturer:
INT
Quantity:
8 800
Part Number:
P28F001BX-T120
Quantity:
6 228
Y
Y
Y
Y
Y
Y
Intel’s 28F001BX-B and 28F001BX-T combine the cost-effectiveness of Intel standard flash memory with
features that simplify write and allow block erase These devices aid the system designer by combining the
functions of several components into one making boot block flash an innovative alternative to EPROM and
EEPROM or battery-backed static RAM Many new and existing designs can take advantage of the
28F001BX’s integration of blocked architecture automated electrical reprogramming and standard processor
interface
The 28F001BX-B and 28F001BX-T are 1 048 576 bit nonvolatile memories organized as 131 072 bytes of
8 bits They are offered in 32-pin plastic DIP 32-lead PLCC and 32-lead TSOP packages Pin assignment
conform to JEDEC standards for byte-wide EPROMs These devices use an integrated command port and
state machine for simplified block erasure and byte reprogramming The 28F001BX-T’s block locations pro-
vide compatibility with microprocessors and microcontrollers that boot from high memory such as Intel’s
MCS -186 family 80286 i386
the 28F001BX-B memory map is tailored for microprocessors and microcontrollers that boot from low memory
such as Intel’s MCS-51 MCS-196 80960KX and 80960SX families All other features are identical and unless
otherwise noted the term 28F001BX can refer to either device throughout the remainder of this document
The boot block section includes a reprogramming write lock out feature to guarantee data integrity It is
designed to contain secure code which will bring up the system minimally and download code to the other
locations of the 28F001BX Intel’s 28F001BX employs advanced CMOS circuitry for systems requiring high-
performance access speeds low power consumption and immunity to noise Its access time provides
no-WAIT-state performance for a wide range of microprocessors and microcontrollers A deep-powerdown
mode lowers power consumption to 0 25 W typical through V
mentation and other low-power applications The RP
tion during system powerup or power loss
Manufactured on Intel’s ETOX process base the 28F001BX builds on years of EPROM experience to yield the
highest levels of quality reliability and cost-effectiveness
High-Integration Blocked Architecture
100 000 Erase Program Cycles Per
Block
Simplified Program and Erase
SRAM-Compatible Write Interface
Deep Power-Down Mode
12 0V
Information in this document is provided in connection with Intel products Intel assumes no liability whatsoever including infringement of any patent or
copyright for sale and use of Intel products except as provided in Intel’s Terms and Conditions of Sale for such products Intel retains the right to make
changes to these specifications at any time without notice Microcomputer Products may have minor variations to this specification known as errata
COPYRIGHT
Other brands and names are the property of their respective owners
NOTE The 28F001BN is equivalent to the 28F001BX
One 8 KB Boot Block w Lock Out
Two 4 KB Parameter Blocks
One 112 KB Main Block
Automated Algorithms via On-Chip
Write State Machine (WSM)
0 05 A I
0 8 A I
g
5% V
INTEL CORPORATION 1995
PP
CC
Typical
PP
Typical
28F001BX-T 28F001BX-B 28F001BN-T 28F001BN-B
BOOT BLOCK FLASH MEMORY
TM
i486
TM
1-MBIT (128K x 8)
i860
TM
and 80960CA With exactly the same memory segmentation
November 1995
power control input also provides absolute data protec-
Y
Y
Y
Y
Y
High-Performance Read
Hardware Data Protection Feature
Advanced Packaging JEDEC Pinouts
ETOX
Technology
Extended Temperature Options
CC
70 75 ns 90 ns 120 ns 150 ns
Maximum Access Time
5 0V
Erase Write Lockout during Power
Transitions
32-Pin PDIP
32-Lead PLCC TSOP
EPROM-Compatible Process Base
High-Volume Manufacturing
Experience
crucial in laptop computer handheld instru-
TM
g
II Nonvolatile Flash
10% V
CC
Order Number 290406-007

Related parts for P28F001BX-T120

P28F001BX-T120 Summary of contents

Page 1

... Intel products except as provided in Intel’s Terms and Conditions of Sale for such products Intel retains the right to make changes to these specifications at any time without notice Microcomputer Products may have minor variations to this specification known as errata COPYRIGHT INTEL CORPORATION 1995 1-MBIT (128K x 8) High-Performance Read ...

Page 2

Figure 1 28F001BX Block Diagram Symbol Type A –A INPUT ADDRESS INPUTS for memory addresses Addresses are internally latched during write cycle DQ –DQ INPUT DATA INPUTS OUTPUTS Inputs data and commands during memory write ...

Page 3

GND Figure 2 DIP Pin Configuration 28F010 A 11 ...

Page 4

Figure 4 PLCC Lead Configuration APPLICATIONS The 28F001BX flash ‘boot block’ memory augments the non-volatility in-system electrical erasure and reprogrammability of Intel’s standard flash memory by offering four separately erasable blocks and inte- grating a state machine to ...

Page 5

Reprogrammable environments such as the per- sonal computer are ideal applications for the 28F001BX The internal state machine provides SRAM-like timings for program and erasure using the Command and Status Registers The blocking scheme allows BIOS update in the main ...

Page 6

PRINCIPLES OF OPERATION The 28F001BX introduces on-chip write automation to manage write and erase functions The write state machine allows for 100% TTL-level control inputs fixed power supplies during erasure and program- ming minimal processor overhead with RAM-like ...

Page 7

BUS OPERATION Flash memory reads erases and writes in-system via the local CPU All bus cycles to or from the flash memory conform to standard microprocessor bus cycles Read The 28F001BX has three read modes The memory can be read ...

Page 8

The use of RP during system reset is important with automated write erase devices When the sys- tem comes out of reset it expects to read from the flash memory Automated flash memories provide status information when accessed ...

Page 9

Table 3 28F001BX Command Definitions Bus Command Cycles Req’d Read Array Reset 1 Intelligent Identifier 3 Read Status Register 2 Clear Status Register 1 Erase Setup Erase Confirm 2 Erase Suspend Erase Resume 2 Program Setup Program 2 NOTES 1 ...

Page 10

Table 4 28F001BX Status Register Definitions WSMS ESS WRITE STATE MACHINE STATUS e 1 Ready e 0 Busy ERASE SUSPEND STATUS e 1 Erase Suspended e 0 Erase In Progress ...

Page 11

Program Setup Program Commands Programming is executed by a two-write sequence The program Setup command (40H) is written to the Command Register followed by a second write specifying the address and data (latched on the ris- ing edge of WE ...

Page 12

BOOT BLOCK PROGRAM AND ERASE The boot block is intended to contain secure code which will minimally bring up a system and control programming and erase of other blocks of the de- vice if needed Therefore additional ‘‘lockout’’ ...

Page 13

Bus Command Operation Write Erase Setup Write Erase Read Standby Repeat for subsequent blocks Full status check can be done after each block or after a sequence of blocks Write FFH after the last block erase operation to reset the ...

Page 14

Figure 11 28F001BX Erase Suspend Resume Flowchart Programming Equipment For PROM programming equipment that cannot bring RP to high voltage OE provides an alter- nate boot block access mechanism OE sition minimum of 480 ns ...

Page 15

Power Supply Decoupling Flash memory power switching characteristics re- quire careful device coupling System designers are interested in 3 supply current issues standby current levels (I ) active current levels (I ) and transient SB CC peaks producted by falling ...

Page 16

ABSOLUTE MAXIMUM RATINGS Operating Temperature During Read During Erase Program Operating Temperature During Read During Erase Program Temperature under Bias Temperature under Bias 20 ...

Page 17

DC CHARACTERISTICS (Continued 10 Symbol Parameter I V Read Current CCR Programming Current CCP Erase Current CCE CC I ...

Page 18

DC CHARACTERISTICS 10 Symbol Parameter I Input Load Current IL I Output Leakage Current Standby Current CCS Deep Power-Down ...

Page 19

NOTES 1 All currents are in RMS unless otherwise noted Typical values at V are valid for all product versions (packages and speeds specified with the device deselected If the 28F001BX is read while in Erase Suspend ...

Page 20

AC CHARACTERISTICS Read-Only Operations Symbol Parameter t t Read Cycle Time AVAV Address to Output Delay AVQV ACC Output Delay ELQV Output Delay PHQV PWH t ...

Page 21

... Sampled not 100% tested 28F001BX-T 28F001BX-B (1) E28F001BX-120 10% N28F001BX-120 P28F001BX-120 Notes Min Max 120 120 3 120 600 PLCC P PDIP T Extended Temperature Refer without impact E28F001BX-150 TE28F001BX-150 N28F001BX-150 Unit TN28F001BX-150 P28F001BX-150 Min Max 150 ns 150 ns 150 ns 600 ...

Page 22

Figure 12 AC Waveform for Read Operations 22 ...

Page 23

AC CHARACTERISTICS Write Erase Program Operations Symbol Parameter t t Write Cycle Time AVAV High Recovery to WE PHWL PS Going Low Setup to WE Going Low ELWL Pulse ...

Page 24

AC CHARACTERISTICS Write Erase Program Operations Versions Symbol Parameter t t Write Cycle Time AVAV High Recovery to WE PHWL Setup to WE ELWL Pulse Width ...

Page 25

ERASE AND PROGRAMMING PERFORMANCE Parameter Notes Boot Block Erase Time Boot Block Program Time Parameter Block Erase Time Parameter Block Program Time Main Block Erase Time Main Block Program Time Chip Erase Time Chip Program Time NOTES ...

Page 26

Figure 13 28F001BX Typical Programming Capability Figure 15 28F001BX Typical Erase Capability 26 290406– 19 Figure 14 28F001BX Typical Programming Time at 12V 290406– 21 Figure 16 28F001BX Typical Erase Time at 12V 290406 –20 290406 –22 ...

Page 27

Figure 17 AC Waveform for Write Operations 28F001BX-T 28F001BX-B 27 ...

Page 28

Figure 18 Alternate Boot Block Access Method Using OE 28 290406 –15 ...

Page 29

AC CHARACTERISTICS FOR CE -CONTROLLED WRITES Symbol Parameter t t Write Cycle Time AVAV High Recovery to CE PHEL PS Going Low Setup to CE Going Low WLEL Pulse ...

Page 30

AC CHARACTERISTICS FOR CE -CONTROLLED WRITES Versions Symbol Parameter t t Write Cycle Time AVAV High Recovery to CE PHEL Setup to CE Going Low WLEL ...

Page 31

Figure 19 Alternate AC Waveform for Write Operations 28F001BX-T 28F001BX-B 31 ...

Page 32

... Layout Planning Using Intel’s Boot Block Flash Memory’’ 294005 ER-20 ‘‘ETOX II Flash Memory Technology’’ 32 32-Lead PLCC 32-Pin PDIP N28F001BX-T70 P28F001BX-T70 N28F001BX-T90 P28F001BX-T90 N28F001BX-T120 P28F001BX-T120 N28F001BX-T150 P28F001BX-T150 N28F001BX-B70 P28F001BX-B70 N28F001BX-B90 P28F001BX-B90 N28F001BX-B120 P28F001BX-B120 N28F001BX-B150 P28F001BX-B150 TN28F001BX-T90 ...

Page 33

Revision History Number -004 Removed Preliminary classification Latched address A in Figure 5 16 Updated Boot Block Program and Erase section ‘‘If boot block program or erase is attempted while either the Program Status or Erase ...

Related keywords