RF3166 RF Micro Devices, RF3166 Datasheet
RF3166
Specifications of RF3166
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RF3166 Summary of contents
Page 1
... The device is designed for use as the final RF amplifier in GSM850, EGSM900, DCS and PCS handheld digital cel- lular equipment and other applications in the 824MHz to 849MHz, 880MHz to 915MHz, 1710MHz to 1785MHz and 1850MHz to 1910MHz bands. The RF3166 incorpo- rates RFMD’s latest V tracking circuit, which monitors BATT battery voltage and prevents the power control loop from reaching saturation ...
Page 2
... RF3166 Absolute Maximum Ratings Parameter Supply Voltage Power Control Voltage (V ) RAMP Input RF Power Max Duty Cycle Output Load VSWR Operating Case Temperature Storage Temperature Parameter Min. Overall Power Control V RAMP Power Control “ON” Power Control “OFF” V Input Capacitance RAMP ...
Page 3
... RF3166 Unit Condition Temp=+25 °C, V =3.5V, BATT V =2.1V, P =3dBm, RAMP IN Freq=824MHz to 849MHz, 25% Duty Cycle, Pulse Width=1154μs MHz dBm Temp=+25°C, V =3.5V, V BATT dBm Temp=+85°C, V =3.0V, V BATT % =3.5V OUT MAX ...
Page 4
... RF3166 Parameter Min. Overall (GSM900 Mode) Operating Frequency Range Maximum Output Power 1 34.2 Maximum Output Power 2 32.0 Total Efficiency Input Power Range Output Noise Power Forward Isolation 1 Forward Isolation 2 Cross Band Isolation 2f 0 Second Harmonic Third Harmonic All Other Non-Harmonic Spurious Input Impedance ...
Page 5
... RF3166 Unit Condition Temp=25°C, V =3.5V, BATT V =2.1V, P =3dBm, RAMP IN Freq=1710MHz to 1785MHz, 25% Duty Cycle, pulse width=1154μs MHz dBm Temp=+25°C, V =3.5V, V BATT dBm Temp=+85°C, V =3.0V, V BATT % =3.5V OUT MAX, ...
Page 6
... RF3166 Parameter Min. Overall (PCS Mode) Operating Frequency Range Maximum Output Power 1 32.0 Maximum Output Power 2 30.0 Total Efficiency Input Power Range Output Noise Power Forward Isolation 1 Forward Isolation 2 Second Harmonic Third Harmonic All Other Non-Harmonic Spurious Input Impedance Input VSWR Output Load VSWR Stability ...
Page 7
... DCS/PCS RF output for the DCS band. This is a 50Ω output. The output load line matching is contained internal to the package. OUT Pkg GND Base Rev A3 061031 RF3166 Interface Schematic BAND SEL GSM CTRL TX EN DCS CTRL VBATT 300 kHz ...
Page 8
... RF3166 BAND SELECT 2-498 Pin Out Top Down View DCS/PCS 1 RFIN 2 TX ENABLE 3 VBATT 4 GND 5 VRAMP 6 GSM DCS/PCS 9 RFOUT GSM 8 RFOUT Rev A3 061031 ...
Page 9
... The 50 Ω μstrip between the PA output pad and the SMA connector has an approximate insertion loss of 0.1 dB for GSM850/EGSM900 and 0.2 dB for DCS1800/PCS1900 bands. Rev A3 061031 Application Schematic RF3166 50 Ω μstrip 9 DCS/PCS OUT 50 Ω μstrip 8 GSM OUT GND P2-1 1 VCC CON1 CON1 50 Ω μstrip 9 DCS/PCS OUT 50 Ω ...
Page 10
... RF3166 Board Thickness 0.032”, Board Material FR-4, Multi-Layer 2-500 Evaluation Board Layout Board Size 2.0” x 2.0” Rev A3 061031 ...
Page 11
... The indirect closed loop is essentially a closed loop method of power control that is invisible to the user. Most power con- trol systems in GSM sense either forward power or collector/drain current. The RF3166 does not use a power detector. A high-speed control loop is incorporated to regulate the collector voltage of the amplifier while the stage are held at a con- stant bias ...
Page 12
... the noise figure depends on noise factor and gain in all stages. Because the bias point of the RF3166 is kept constant the gain in the first stage is always high and the overall noise power is not increased when decreasing output power. Power control loop stability often presents many challenges to transmitter design. Designing a proper power control loop involves trade-offs affecting stability, transient spectrum and burst timing ...
Page 13
... VCO decreases (or increases) with respect to temperature or supply voltage. The burst timing then appears to shift to the right especially at low power levels. The RF3166 is insensitive to a change in input power and the burst timing is constant and requires no software compensation. ...
Page 14
... RF3166 PCB Surface Finish The PCB surface finish used for RFMD’s qualification process is electroless nickel, immersion gold. Typical thickness is 3μinch to 8μinch gold over 180μinch nickel. PCB Land Pattern Recommendation PCB land patterns are based on IPC-SM-782 standards when possible. The pad pattern shown has been developed and tested for optimized assembly at RFMD ...