STU13NB60 STMicroelectronics, STU13NB60 Datasheet

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STU13NB60

Manufacturer Part Number
STU13NB60
Description
Manufacturer
STMicroelectronics
Datasheet
DESCRIPTION
Using the latest high voltage MESH OVERLAY
process,
advanced family of power MOSFETs with
outstanding performances. The new patent
pending strip layout coupled with the Company’s
proprietary edge termination structure, gives the
lowest R
and dv/dt capabilities and unrivalled gate charge
and switching characteristics.
APPLICATIONS
This is preliminary information on a new product now in development or undergoing evaluation. Details are subject to change without notice.
ABSOLUTE MAXIMUM RATINGS
( ) Pulse width limited by safe operating area
October 1997
STU13NB60
Symbol
dv/dt(
TYPICAL R
EXTREMELY HIGH dv/dt CAPABILITY
100% AVALANCHE TESTED
VERY LOW INTRINSIC CAPACITANCES
GATE CHARGE MINIMIZED
SWITCH MODE POWER SUPPLIES (SMPS)
DC-AC CONVERTERS FOR WELDING
EQUIPMENT AND UNINTERRUPTIBLE
POWER SUPPLIES AND MOTOR DRIVE
I
V
DM
V
V
P
T
DGR
30V GATE TO SOURCE VOLTAGE RATING
I
I
T
DS
GS
stg
D
D
t ot
TYPE
( )
j
1
)
DS(on)
Drain-source Voltage (V
Drain- gate Voltage (R
Gate-source Voltage
Drain Current (continuous) at T
Drain Current (continuous) at T
Drain Current (pulsed)
Total Dissipation at T
Derating F actor
Peak Diode Recovery voltage slope
Storage T emperature
Max. O perating Junction Temperature
SGS-Thomson
DS(on)
per area, exceptional avalanche
600 V
V
= 0.4
DSS
< 0.45
has
R
DS(on)
c
Parameter
GS
= 25
GS
designed
= 20 k )
N-CHANNEL ENHANCEMENT MODE
= 0)
o
C
12.6 A
c
c
= 25
= 100
I
D
an
o
C
o
C
(
1
) I
SD
PowerMESH
13A, di/dt
INTERNAL SCHEMATIC DIAGRAM
200 A/ s, V
-65 to 150
Max220
Value
DD
12.6
50.4
1.28
600
600
160
150
STU13NB60
7.9
4.5
30
V
(BR)DSS
PRELIMINARY DATA
1
2
, Tj
3
MOSFET
T
JMAX
W/
Uni t
V/ ns
o
o
W
V
V
V
A
A
A
C
C
o
C
1/6

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STU13NB60 Summary of contents

Page 1

... This is preliminary information on a new product now in development or undergoing evaluation. Details are subject to change without notice. PowerMESH I D 12.6 A Max220 an INTERNAL SCHEMATIC DIAGRAM Value 100 -65 to 150 ( ) I 13A, di/dt 200 STU13NB60 MOSFET PRELIMINARY DATA Uni t 600 V 600 12.6 A 7.9 A 50.4 A 160 4.5 ...

Page 2

... STU13NB60 THERMAL DATA R Thermal Resistance Junction-case t hj-ca se Thermal Resistance Junction-ambient Rthj -amb R Thermal Resistance Case-sink thc Maximum Lead Temperature For Soldering Purpose l AVALANCHE CHARACTERISTICS Symb ol Parameter I Avalanche Current, Repetitive or Not-Repetitive AR (pulse width limited by T max Single Pulse Avalanche Energy ...

Page 3

... Test Cond ition s Min. = 480 12 4 Test Cond ition s Min 12.6 A di/dt = 100 100 150 C j STU13NB60 Typ . Max Typ . Max Typ ...

Page 4

... STU13NB60 Fig. 1: Unclamped Inductive Load Test Circuit Fig. 3: Switching Times Test Circuits For Resistive Load Fig. 5: Test Circuit For Inductive Load Switching And Diode Recovery Times 4/6 Fig. 2: Unclamped Inductive Waveform Fig. 4: Gate Charge test Circuit ...

Page 5

... E 10. inch MAX. MIN. TYP. 4.6 0.169 2.4 0.087 3.1 0.114 0.93 0.027 1.4 0.049 1.38 0.047 0.6 0.18 16.3 0.626 9.35 0.354 1.2 0.031 3.2 0.110 2.64 0.096 10.35 0.396 13.6 0.520 3.4 0.118 STU13NB60 MAX. 0.181 0.094 0.122 0.036 0.055 0.054 0.023 0.641 0.368 0.047 0.126 0.104 0.407 0.535 0.133 P011R 5/6 ...

Page 6

... STU13NB60 Information furnished is believed to be accurate and reliable. However, SGS-THOMSON Microelectronics assumes no responsability for the consequences of use of such information nor for any infringement of patents or other rights of third parties which may results from its use. No license is granted by implication or otherwise under any patent or patent rights of SGS-THOMSON Microelectronics. Specifications mentioned in this publication are subject to change without notice ...

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