MT48LC2M32B2TG-7IT Micron Semiconductor Products, MT48LC2M32B2TG-7IT Datasheet

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MT48LC2M32B2TG-7IT

Manufacturer Part Number
MT48LC2M32B2TG-7IT
Description
64Mb: x32 SDRAM
Manufacturer
Micron Semiconductor Products
Datasheet

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SYNCHRONOUS
DRAM
FEATURES
• PC100 functionality
• Fully synchronous; all signals registered on positive
• Internal pipelined operation; column address can
• Internal banks for hiding row access/precharge
• Programmable burst lengths: 1, 2, 4, 8, or full page
• Auto Precharge, includes CONCURRENT AUTO
• Self Refresh Mode
• 64ms, 4,096-cycle refresh (15.6µs/row)
• LVTTL-compatible inputs and outputs
• Single +3.3V ±0.3V power supply
• Supports CAS latency of 1, 2, and 3.
OPTIONS
• Configuration
• Plastic Package - OCPL
• Timing (Cycle Time)
• Operating Temperature Range
NOTE:
KEY TIMING PARAMETERS
*CL = CAS (READ) latency
64Mb: x32 SDRAM
64MSDRAMx32_5.p65 – Rev. 9/00
GRADE
SPEED
edge of system clock
be changed every clock cycle
PRECHARGE, and Auto Refresh Modes
2 Meg x 32 (512K x 32 x 4 banks)
86-pin TSOP (400 mil)
5ns (200 MHz)
5.5ns (183 MHz)
6ns (166 MHz)
7ns (143 MHz)
Commercial (0° to +70°C)
Extended (-40°C to +85°C)
-55
-5
-6
-7
1. Off-center parting line
2. Available on -7
FREQUENCY
200 MHz
183 MHz
166 MHz
143 MHz
CLOCK
MT48LC2M32B2TG-7
Part Number Example:
ACCESS TIME
1
CL = 3*
4.5ns
5.5ns
5.5ns
5ns
SETUP
TIME
1.5ns
1.5ns
1.5ns
2ns
MARKING
2M32B2
None
-55
IT
TG
HOLD
-5
-6
-7
TIME
1ns
1ns
1ns
1ns
2
1
MT48LC2M32B2 - 512K x 32 x 4 banks
For the latest data sheet, please refer to the Micron Web
site:
Note: The # symbol indicates signal is active LOW.
Configuration
Refresh Count
Row Addressing
Bank Addressing
Column Addressing
www.micronsemi.com/datasheets/sdramds.html
PIN ASSIGNMENT (TOP VIEW)
Micron Technology, Inc., reserves the right to change products or specifications without notice.
DQM0
DQM2
DQ16
DQ17
DQ18
DQ19
DQ20
DQ21
DQ22
DQ23
V
V
V
V
CAS#
RAS#
V
V
V
V
WE#
DQ0
DQ1
DQ2
DQ3
DQ4
DQ5
DQ6
DQ7
DD
DD
BA0
BA1
DD
DD
V
V
A10
V
V
CS#
SS
SS
SS
SS
NC
NC
NC
A0
A1
A2
DD
DD
DD
DD
Q
Q
Q
Q
Q
Q
Q
Q
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
25
26
27
28
29
30
31
32
33
34
35
36
37
38
39
40
41
42
43
86-PIN TSOP
512K x 32 x 4 banks
2 Meg x 32
4 (BA0, BA1)
2K (A0-A10)
256 (A0-A7)
4K
64Mb: x32
86
85
84
83
82
81
80
79
78
77
76
75
74
73
72
71
70
69
68
67
66
65
64
63
62
61
60
59
58
57
56
55
54
53
52
51
50
49
48
47
46
45
44
©2000, Micron Technology, Inc.
SDRAM
V
DQ15
V
DQ14
DQ13
V
DQ12
DQ11
V
DQ10
DQ9
V
DQ8
NC
V
DQM1
NC
NC
CLK
CKE
A9
A8
A7
A6
A5
A4
A3
DQM3
V
NC
DQ31
V
DQ30
DQ29
V
DQ28
DQ27
V
DQ26
DQ25
V
DQ24
V
SS
SS
DD
SS
DD
SS
SS
DD
SS
DD
SS
SS
Q
Q
Q
Q
Q
Q
Q
Q

Related parts for MT48LC2M32B2TG-7IT

MT48LC2M32B2TG-7IT Summary of contents

Page 1

... MHz) 6ns (166 MHz) 7ns (143 MHz) • Operating Temperature Range Commercial (0° to +70°C) Extended (-40°C to +85°C) NOTE: 1. Off-center parting line 2. Available on -7 Part Number Example: MT48LC2M32B2TG-7 KEY TIMING PARAMETERS SPEED CLOCK ACCESS TIME GRADE FREQUENCY 200 MHz 4 ...

Page 2

... SDRAM PART NUMBER PART NUMBER ARCHITECTURE MT48LC2M32B2TG 2 Meg x 32 GENERAL DESCRIPTION The 64Mb SDRAM is a high-speed CMOS, dynamic random-access memory containing 67,108,864-bits internally configured as a quad-bank DRAM with a synchronous interface (all signals are registered on the positive edge of the clock signal, CLK). Each of the 16,777,216-bit banks is organized as 2,048 rows by 256 columns by 32 bits ...

Page 3

TABLE OF CONTENTS Functional Block Diagram - 2 Meg x 32 ................. Pin Descriptions ..................................................... Functional Description ......................................... Initialization ...................................................... Register Definition ............................................ Mode Register ............................................... Burst Length ............................................ Burst Type ............................................... CAS Latency ............................................ Operating Mode ...................................... Write Burst ...

Page 4

CKE CLK CONTROL CS# LOGIC WE# CAS# RAS# REFRESH COUNTER MODE REGISTER 11 11 A0-A10, ADDRESS 13 BA0, BA1 REGISTER 8 64Mb: x32 SDRAM 64MSDRAMx32_5.p65 – Rev. 9/00 FUNCTIONAL BLOCK DIAGRAM 2 Meg x 32 SDRAM BANK0 11 BANK0 ROW- ...

Page 5

PIN DESCRIPTIONS PIN NUMBERS SYMBOL 68 CLK 67 CKE 20 CS# 17, 18, 19 WE#, CAS#, RAS# 16, 71, 28, 59 DQM0- DQM3 22, 23 BA0, BA1 25-27, 60-66, 24 A0-A10 10, 11, 13, DQ0-DQ31 ...

Page 6

FUNCTIONAL DESCRIPTION In general, this 64Mb SDRAM (512K banks quad-bank DRAM that operates at 3.3V and includes a synchronous interface (all signals are regis- tered on the positive edge of the clock signal, CLK). ...

Page 7

BURST TYPE Accesses within a given burst may be programmed to be either sequential or interleaved; this is referred to as the burst type and is selected via bit M3. The ordering of accesses within a burst is determined by ...

Page 8

CAS Latency The CAS latency is the delay, in clock cycles, between the registration of a READ command and the availabil- ity of the first piece of output data. The latency can be set to one, two or three clocks. ...

Page 9

Commands Truth Table 1 provides a quick reference of available commands. This is followed by a written description of each command. Three additional Truth Tables appear TRUTH TABLE 1 – COMMANDS AND DQM OPERATION (Note: 1) NAME (FUNCTION) COMMAND INHIBIT ...

Page 10

COMMAND INHIBIT The COMMAND INHIBIT function prevents new commands from being executed by the SDRAM, regard- less of whether the CLK signal is enabled. The SDRAM is effectively deselected. Operations already in progress are not affected. NO OPERATION (NOP) The ...

Page 11

BURST TERMINATE The BURST TERMINATE command is used to trun- cate either fixed-length or full-page bursts. The most recently registered READ or WRITE command prior to the BURST TERMINATE command will be truncated, as shown in the Operation section of ...

Page 12

Operation BANK/ROW ACTIVATION Before any READ or WRITE commands can be issued to a bank within the SDRAM, a row in that bank must be “opened.” This is accomplished via the ACTIVE command, which selects both the bank and the ...

Page 13

READs READ bursts are initiated with a READ command, as shown in Figure 5. The starting column and bank addresses are pro- vided with the READ command, and auto precharge is either enabled or disabled for that burst access. If ...

Page 14

Figure 7 for CAS latencies of one, two and three; data element either the last of a burst of four or the last desired of a longer burst. This 64Mb SDRAM uses a ...

Page 15

CLK COMMAND ADDRESS DQ CAS Latency = 1 CLK COMMAND ADDRESS DQ CLK COMMAND ADDRESS DQ NOTE: Each READ command may be to either bank. DQM is LOW. 64Mb: x32 SDRAM 64MSDRAMx32_5.p65 – Rev. 9/ READ ...

Page 16

Data from any READ burst may be truncated with a subsequent WRITE command, and data from a fixed- length READ burst may be immediately followed by data from a WRITE command (subject to bus turn- around limitations). The WRITE burst ...

Page 17

A fixed-length READ burst may be followed by, or truncated with, a PRECHARGE command to the same bank (provided that auto precharge was not activated), and a full-page burst may be truncated with a PRECHARGE command to the same bank. ...

Page 18

The disadvantage of the PRECHARGE command is that it requires that the command and address buses be available at the appro- priate time to issue the command; the ...

Page 19

WRITEs WRITE bursts are initiated with a WRITE command, as shown in Figure 13. The starting column and bank addresses are pro- vided with the WRITE command, and auto precharge is either enabled or disabled for that access. If auto ...

Page 20

READ command, and data for a fixed- length WRITE burst may be immediately followed by a READ command. Once the READ command is regis- tered, the data inputs will be ignored, and WRITEs will not be executed. An example ...

Page 21

BURST TERMINATE command. When truncating a WRITE burst, the input data applied coincident with the BURST TERMINATE command will be ignored. The last data written (provided that DQM is LOW at that time) will be the input ...

Page 22

CLOCK SUSPEND The clock suspend mode occurs when a column access/burst is in progress and CKE is registered LOW. In the clock suspend mode, the internal clock is deacti- vated, “freezing” the synchronous logic. For each positive clock edge on ...

Page 23

CONCURRENT AUTO PRECHARGE An access command to (READ or WRITE) another bank while an access command with auto precharge enabled is executing is not allowed by SDRAMs, unless the SDRAM supports CONCURRENT PRECHARGE. Micron SDRAMs support CONCUR- RENT AUTO PRECHARGE. ...

Page 24

WRITE WITH AUTO PRECHARGE 3. Interrupted by a READ (with or without auto precharge): A READ to bank m will interrupt a WRITE on bank n when registered, with the data- out appearing CAS latency later. The PRECHARGE t to ...

Page 25

TRUTH TABLE 2 – CKE (Notes: 1-4) CKE CKE CURRENT STATE n Power-Down Self Refresh Clock Suspend L H Power-Down Self Refresh Clock Suspend H L All Banks Idle All Banks Idle Reading or Writing H H ...

Page 26

TRUTH TABLE 3 – CURRENT STATE BANK n, COMMAND TO BANK n (Notes: 1-6; notes appear below and on next page) CURRENT STATE CS# RAS# CAS# WE# Any Idle L L ...

Page 27

NOTE (continued): Write w/Auto Precharge Enabled: 5. The following states must not be interrupted by any executable command; COMMAND INHIBIT or NOP commands must be applied on each positive clock edge during these states. Refreshing: Starts with registration of an ...

Page 28

TRUTH TABLE 4 – CURRENT STATE BANK n, COMMAND TO BANK m (Notes: 1-6; notes appear below and on next page) CURRENT STATE CS# RAS# CAS# WE# Any Idle Row L ...

Page 29

NOTE (continued): 4. AUTO REFRESH, SELF REFRESH, and LOAD MODE REGISTER commands may only be issued when all banks are idle BURST TERMINATE command cannot be issued to another bank; it applies to the bank represented by the ...

Page 30

ABSOLUTE MAXIMUM RATINGS* Voltage Supply DD DD Relative to V ........................................ -1V to +4.6V SS Voltage on Inputs I/O Pins Relative to V ........................................ -1V to +4.6V SS Operating Temperature ........................ ...

Page 31

I SPECIFICATIONS AND CONDITIONS DD (Notes 11, 13, 27; notes appear on page 35) (V PARAMETER/CONDITION OPERATING CURRENT: Active Mode; t Burst = 2; READ or WRITE CAS latency = 3 STANDBY CURRENT: Power-Down Mode; CKE ...

Page 32

CAPACITANCE (Note: 2; notes appear on page 35) PARAMETER Input Capacitance: CLK Input Capacitance: All other input-only pins Input/Output Capacitance: DQs ELECTRICAL CHARACTERISTICS AND RECOMMENDED AC OPERATING CONDITIONS (Notes 11; notes appear on page 35) AC ...

Page 33

ELECTRICAL CHARACTERISTICS AND RECOMMENDED AC OPERATING CONDITIONS (Notes 11; notes appear on page 35) AC CHARACTERISTICS PARAMETER Access time from CLK (pos. edge) Address hold time Address setup time CLK high-level width CLK low-level width Clock ...

Page 34

AC FUNCTIONAL CHARACTERISTICS (Notes 11; notes appear on page 35) PARAMETER READ/WRITE command to READ/WRITE command CKE to clock disable or power-down entry mode CKE to clock enable or power-down exit setup mode DQM to ...

Page 35

NOTES 1. All voltages referenced This parameter is sampled MHz 25°C; pin under test biased at 1.4V can range from 0pF to 6pF dependent on ...

Page 36

INITIALIZE AND LOAD MODE REGISTER CLK ( ( ) ) t CKH t CKS ( ( ) ) CKE ( ( ) ) t CMH t CMS t CMH t CMS ( ( ) ) COMMAND ...

Page 37

CLK CKE t CKS t CKH t CMS t CMH COMMAND PRECHARGE DQM 0-3 A0-A9 ALL BANKS A10 SINGLE BANK BA0, BA1 BANK(S) High-Z DQ Two clock cycles Precharge all All banks idle, ...

Page 38

CLK t CKS t CKH CKE t CKS t CKH t CMS t CMH COMMAND READ NOP t CMS t CMH DQM0 A0-A9 COLUMN ...

Page 39

T0 T1 CLK t CK CKE t CKS t CKH t CMS t CMH COMMAND PRECHARGE NOP DQM 0-3 A0-A9 ALL BANKS A10 SINGLE BANK BA0, BA1 BANK(S) High Precharge all active banks ...

Page 40

T0 T1 CLK t CK CKE t CKS t CKH t CMS t CMH COMMAND PRECHARGE NOP DQM 0-3 A0-A9 ALL BANKS A10 SINGLE BANK BA0, BA1 BANK(S) High Precharge all active banks ...

Page 41

T0 CLK t CKS t CKH CKE t CMS t CMH COMMAND ACTIVE DQM / DQML, DQMH A0-A9, A11 ROW ROW A10 BA0, BA1 BANK DQ TIMING PARAMETERS ...

Page 42

CLK t CKS t CKH CKE t CMS t CMH COMMAND ACTIVE NOP t CMS DQM 0 ROW A0- ROW A10 DISABLE AUTO PRECHARGE t AS ...

Page 43

CLK t CKS t CKH CKE t CMS t CMH COMMAND ACTIVE NOP t CMS DQM 0 A0-A9 ROW ENABLE AUTO PRECHARGE ROW A10 ...

Page 44

ALTERNATING BANK READ ACCESSES CLK t CKS t CKH CKE t CMS t CMH COMMAND ACTIVE NOP t CMS DQM 0 ROW A0- ENABLE AUTO PRECHARGE ROW A10 ...

Page 45

CLK CKS t CKH CKE t CMS t CMH COMMAND ACTIVE NOP READ t CMS DQM 0 A0-A9 COLUMN m 2 ROW ...

Page 46

CLK t CKS t CKH CKE t CMS t CMH COMMAND ACTIVE NOP t CMS DQM 0 A0-A9 ROW ENABLE AUTO PRECHARGE ROW A10 DISABLE AUTO PRECHARGE t ...

Page 47

CLK t CKS t CKH CKE t CMS t CMH COMMAND ACTIVE DQM / DQML, DQMH A0-A9, A11 ROW ROW A10 BA0, BA1 BANK DQ ...

Page 48

CLK t CKS t CKH CKE t CMS t CMH COMMAND ACTIVE NOP t CMS DQM 0 A0-A9 ROW ROW A10 DISABLE AUTO PRECHARGE ...

Page 49

CLK t CKS t CKH CKE t CMS t CMH COMMAND ACTIVE NOP WRITE t CMS DQM 0 A0-A9 COLUMN m 3 ROW ENABLE AUTO PRECHARGE ...

Page 50

ALTERNATING BANK WRITE ACCESSES CLK t CKS t CKH CKE t CMS t CMH COMMAND ACTIVE NOP t CMS DQM 0 COLUMN m 3 ROW A0- ...

Page 51

CLK CKS t CKH CKE t CMS t CMH COMMAND ACTIVE NOP DQM 0 A0-A9 ROW ROW A10 BA0, BA1 BANK ...

Page 52

CLK t CKS t CKH CKE t CMS t CMH COMMAND ACTIVE NOP DQM 0 A0-A9 ROW ROW A10 BA0, BA1 BANK DQ t ...

Page 53

TYP 0.20 R .75 (2X) PIN # 1.00 (2X) 1. All dimensions in millimeters MAX or typical where noted. NOTE: 2. Package width and length do not include mold protrusion; allowable mold protrusion is 0.025mm ...

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