MT48LC2M8A1TG-8S Micron Semiconductor Products, MT48LC2M8A1TG-8S Datasheet

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MT48LC2M8A1TG-8S

Manufacturer Part Number
MT48LC2M8A1TG-8S
Description
SYNCHRONOUS DRAM
Manufacturer
Micron Semiconductor Products
Datasheet
SYNCHRONOUS
DRAM
FEATURES
• PC100-compliant; includes CONCURRENT AUTO
• Fully synchronous; all signals registered on positive
• Internal pipelined operation; column address can be
• Internal banks for hiding row access/precharge
• Programmable burst lengths: 1, 2, 4, 8 or full page
• Auto Precharge and Auto Refresh Modes
• Self Refresh Mode
• 64ms, 4,096-cycle refresh
• LVTTL-compatible inputs and outputs
• Single +3.3V 0.3V power supply
• Longer lead TSOP for improved reliability (OCPL*)
• One- and two-clock WRITE recovery (
OPTIONS
• Configurations
• WRITE Recovery (
• Plastic Package - OCPL*
• Timing (Cycle Time)
• Part Number Example: MT48LC2M8A1TG-10 S
NOTE: The 16Mb SDRAM base number differentiates the offerings in two
KEY TIMING PARAMETERS
*Off-center parting line
**CL = CAS (READ) latency
16 Meg: x4, x8 SDRAM
16MSDRAMx4x8.p65 – Rev. 5/98
GRADE
SPEED
PRECHARGE
edge of system clock
changed every clock cycle
4 Meg x 4 (2 Meg x 4 x 2 banks)
2 Meg x 8 (1 Meg x 8 x 2 banks)
t
t
44-pin TSOP (400 mil)
8ns;
10ns;
-8B
-8B
WR = 1 CLK
WR = 2 CLK
-10
-10
places: MT48LC2M8A1 S. The fourth field distinguishes the
architecture offering: 4M4 designates 4 Meg x 4, and 2M8 designates
2 Meg x 8. The fifth field distinguishes the WRITE recovery offering:
A1 designates one CLK and A2 designates two CLKs.
t
AC = 6ns @ CL = 3
t
AC = 9ns @ CL = 2
FREQUENCY
125 MHz
100 MHz
83 MHz
66 MHz
CLOCK
(Contact factory for availability.)
t
WR/
CL = 2** CL = 3**
9ns
9ns
ACCESS TIME
t
DPL)
7.5ns
6ns
t
WR) versions
SETUP
TIME
2ns
3ns
2ns
3ns
MARKING
4M4
2M8
TG
-8B
A1
A2
-10
HOLD
TIME
1ns
1ns
1ns
1ns
1
MT48LC4M4A1/A2 S - 2 Meg x 4 x 2 banks
MT48LC2M8A1/A2 S - 1 Meg x 8 x 2 banks
For the latest data sheet revisions, please refer to the Micron
Web site: www.micron.com/mti/msp/html/datasheet.html
16Mb (x4/x8) SDRAM PART NUMBERS
GENERAL DESCRIPTION
namic random-access memory containing 16,777,216
bits. It is internally configured as a dual memory array
(the 4 Meg x 4 is a dual 2 Meg x 4, and the 2 Meg x 8 is a dual
1 Meg x 8) with a synchronous interface (all signals are
registered on the positive edge of the clock signal, CLK).
Each of the two internal banks is organized with 2,048 rows
NOTE: The # symbol indicates signal is active LOW. A dash (-)
Configuration
Refresh Count
Row Addressing
Bank Addressing
Column Addressing
PART NUMBER
MT48LC4M4A1TG S
MT48LC2M8A1TG S
The Micron 16Mb SDRAM is a high-speed CMOS, dy-
DQ0
DQ1
x4
NC
NC
indicates x4 pin function is same as x8 pin function.
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
PIN ASSIGNMENT (Top View)
CAS#
RAS#
V
V
VssQ
VssQ
Micron Technology, Inc., reserves the right to change products or specifications without notice.
WE#
DQ0
DQ1
DQ2
DQ3
CS#
DD
DD
V
A10
V
x8
NC
NC
BA
A0
A1
A2
A3
DD
DD
Q
Q
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
2 Meg x 4 x 2 banks
44-Pin TSOP
2K (A0-A10)
1K (A0-A9)
4 MEG x 4
2 (BA)
4K
ARCHITECTURE
4 Meg x 4 (
2 Meg x 8 (
16 MEG: x4, x8
44
43
42
41
40
39
38
37
36
35
34
33
32
31
30
29
28
27
26
25
24
23
t
t
WR = 1 CLK)
WR = 1 CLK)
1 Meg x 8 x 2 banks
2K (A0-A10)
512 (A0-A8)
Vss
DQ7
VssQ
DQ6
V
DQ5
VssQ
DQ4
V
NC
NC
DQM
CLK
CKE
NC
A9
A8
A7
A6
A5
A4
Vss
1998, Micron Technology, Inc.
SDRAM
x8
DD
DD
2 MEG x 8
1 (BA)
Q
Q
4K
NC
DQ3
NC
DQ2
x4
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-

Related parts for MT48LC2M8A1TG-8S

MT48LC2M8A1TG-8S Summary of contents

Page 1

... AC = 6ns @ 10ns 9ns @ • Part Number Example: MT48LC2M8A1TG-10 S NOTE: The 16Mb SDRAM base number differentiates the offerings in two places: MT48LC2M8A1 S. The fourth field distinguishes the architecture offering: 4M4 designates 4 Meg x 4, and 2M8 designates 2 Meg x 8. The fifth field distinguishes the WRITE recovery offering: A1 designates one CLK and A2 designates two CLKs ...

Page 2

GENERAL DESCRIPTION (continued) and either 1,024 columns by 4 bits (4 Meg 512 columns by 8 bits (2 Meg x 8). Read and write accesses to the SDRAM are burst oriented; accesses start at a selected location ...

Page 3

TABLE OF CONTENTS Functional Block Diagram - 4 Meg x 4 ........................... Functional Block Diagram - 2 Meg x 8 ........................... Pin Descriptions ................................................................. Functional Description .................................................... Initialization ................................................................. Register Definitions ..................................................... Mode Register ........................................................ Burst Length ..................................................... Burst Type ...

Page 4

CKE CLK CONTROL CS# LOGIC WE# CAS# RAS# MODE REGISTER 12 REFRESH ADDRESS CONTROLLER A0-A10 REGISTER REFRESH 11 COUNTER 11 16 Meg: x4, x8 SDRAM 16MSDRAMx4x8.p65 – Rev. 5/98 FUNCTIONAL BLOCK DIAGRAM 4 Meg x 4 SDRAM ROW- ...

Page 5

CKE CLK CONTROL CS# LOGIC WE# CAS# RAS# MODE REGISTER 12 REFRESH ADDRESS CONTROLLER A0-A10 REGISTER REFRESH 11 COUNTER 11 16 Meg: x4, x8 SDRAM 16MSDRAMx4x8.p65 – Rev. 5/98 FUNCTIONAL BLOCK DIAGRAM 2 Meg x 8 SDRAM ROW- ...

Page 6

PIN DESCRIPTIONS PIN NUMBERS SYMBOL 32 CLK 31 CKE 15 CS# 14, 13, RAS#, CAS#, 12 WE# 33 DQM 16 BA 18-21, 24-29, 17 A0-A10 4, 8, 37, 41 x4: DQ0 x8: DQ1 ...

Page 7

FUNCTIONAL DESCRIPTION In general, the SDRAM is a dual memory array (the 4 Meg dual 2 Meg x 4, and the 2 Meg dual 1 Meg x 8) which operates at 3.3V ...

Page 8

BA A10 Reserved Mode CAS Latency BT *Should program M11, M10 = ensure compatibility with future devices ...

Page 9

CAS Latency The CAS latency is the delay, in clock cycles, between the registration of a READ command and the availability of the first piece of output data. The latency can be set clocks. If ...

Page 10

COMMANDS Truth Table 1 provides a quick reference of available commands. This is followed by a written description of each command. Two additional Truth Tables appear following TRUTH TABLE 1 – Commands and DQM Operation (Notes: 1) NAME (FUNCTION) COMMAND ...

Page 11

COMMAND INHIBIT The COMMAND INHIBIT function prevents new com- mands from being executed by the SDRAM, regardless of whether the CLK signal is enabled. The SDRAM is effec- tively deactivated, or deselected. NO OPERATION (NOP) The NO OPERATION (NOP) command ...

Page 12

AUTO REFRESH AUTO REFRESH is used during normal operation of the SDRAM and is analagous to CAS#-BEFORE-RAS# (CBR) REFRESH in conventional DRAMs. This command is non- persistent must be issued each time a refresh is required. The addressing ...

Page 13

OPERATION BANK/ROW ACTIVATION Before any READ or WRITE commands can be issued to a bank within the SDRAM, a row in that bank must be “opened.” This is accomplished via the ACTIVE com- mand, which selects both the bank and ...

Page 14

READs READ bursts are initiated with a READ command, as shown in Figure 5 ( “Don’t Care”on x8). The starting column and bank addresses are provided with the READ command, and AUTO PRECHARGE is either enabled or disabled ...

Page 15

CAS latency minus one. This is shown in Figure 7 for CAS latencies of one, two and three; data element either the last of a burst of four or the last desired of ...

Page 16

T0 CLK COMMAND ADDRESS DQ CAS Latency = 1 T0 CLK COMMAND ADDRESS DQ T0 CLK COMMAND ADDRESS DQ NOTE: Each READ command may be to either bank. DQM is LOW. 16 Meg: x4, x8 SDRAM 16MSDRAMx4x8.p65 – Rev. 5/98 ...

Page 17

A fixed-length READ burst may be followed by, or trun- cated with, a WRITE burst (provided that AUTO PRECHARGE was not activated), and a full-page READ burst may be truncated by a WRITE burst. The WRITE burst may be initiated ...

Page 18

A fixed-length READ burst may be followed by, or trun- cated with, a PRECHARGE command to the same bank (provided that AUTO PRECHARGE was not activated), and a full-page burst may be truncated with a PRECHARGE command to the same ...

Page 19

AUTO PRECHARGE. The disadvantage of the PRECHARGE command is that it requires that the com- mand and address buses be available at the appropriate time to issue the command; the advantage of the PRECHARGE command is that it can ...

Page 20

WRITE s WRITE bursts are initiated with a WRITE command, as shown in Figure 13 ( “Don’t Care” on x8). The starting column and bank addresses are provided with the WRITE command and AUTO PRECHARGE is either enabled ...

Page 21

Full-speed random write accesses can be per- formed to the same bank, as shown in Figure 16, or each subsequent WRITE may be performed to a different bank. A fixed-length WRITE burst may be followed by, or truncated with, ...

Page 22

Fixed-length or full-page WRITE bursts can be truncated with the BURST TERMINATE command. When truncating a WRITE burst, the input data applied coincident with the BURST ...

Page 23

CLOCK SUSPEND The clock suspend mode occurs when a column access/ burst is in progress and CKE is registered LOW. In the clock suspend mode, the internal clock is deactivated, “freezing” the synchronous logic. For each positive clock edge on ...

Page 24

CONCURRENT AUTO PRECHARGE An access command (READ or WRITE) to another bank while an access command with AUTO PRECHARGE en- abled is executing is not allowed by SDRAMs, unless the SDRAM supports CONCURRENT AUTO PRECHARGE. Micron SDRAMs support CONCURRENT AUTO ...

Page 25

WRITE with AUTO PRECHARGE 3. Interrupted by a READ (with or without AUTO PRECHARGE): A READ to bank m will interrupt a WRITE on bank n when registered, with the data-out appearing CAS latency later. The PRECHARGE to bank t ...

Page 26

TRUTH TABLE 2 – CKE (Notes: 1-4) CKE CKE CURRENT STATE n Power-Down Self Refresh Clock Suspend L H Power-Down Self Refresh Clock Suspend H L Both Banks Idle Both Banks Idle Reading or Writing H H ...

Page 27

TRUTH TABLE 3 – Current State Bank n - Command to Bank n (Notes: 1-6; notes appear below and on next page) CURRENT STATE CS# RAS# CAS# WE# Any Idle L ...

Page 28

NOTE (continued): Write w/Auto- Precharge Enabled: Starts with registration of a WRITE command with AUTO PRECHARGE enabled, and ends when 5. The following states must not be interrupted by any executable command; COMMAND INHIBIT or NOP commands must be applied ...

Page 29

TRUTH TABLE 4 – Current State Bank n - Command to Bank m (Notes: 1-6; notes appear below and on next page) CURRENT STATE CS# RAS# CAS# WE# Any Idle Row ...

Page 30

NOTE (continued): Write w/Auto- Precharge Enabled: Starts with registration of a WRITE command with AUTO PRECHARGE enabled, and ends when 4. AUTO REFRESH, SELF REFRESH and LOAD MODE REGISTER commands may only be issued when all banks are idle. 5. ...

Page 31

ABSOLUTE MAXIMUM RATINGS* Voltage Supply DD DD Relative to V ................................................ -1V to +4.6V SS Voltage on Inputs I/O Pins Relative to V ................................................ -1V to +4.6V SS Operating Temperature, T (ambient) .......... 0 ...

Page 32

CAPACITANCE PARAMETER Input Capacitance: CLK Input Capacitance: All other input-only pins Input/Output Capacitance: DQs ELECTRICAL CHARACTERISTICS AND RECOMMENDED AC OPERATING CONDITIONS (Notes 11 + CHARACTERISTICS PARAMETER Access time from CLK ...

Page 33

AC FUNCTIONAL CHARACTERISTICS (Notes 11 PARAMETER READ/WRITE command to READ/WRITE command CKE to clock disable or power-down entry mode CKE to clock enable or power-down exit setup mode DQM to input ...

Page 34

NOTES 1. All voltages referenced This parameter is sampled MHz pin under test biased at 1.4V dependent on output loading and cycle ...

Page 35

INITIALIZE AND LOAD MODE REGISTER CLK ( ( CKH t CKS ( ( ( ( ) ) ) ) CKE ( ( ( ( ) ...

Page 36

CLK CKE t CKS t CKH t CMS t CMH COMMAND PRECHARGE NOP DQM ADDRESS BANK(S) High-Z DQ Two clock cycles Precharge all All banks idle, enter active banks. power-down mode. TIMING ...

Page 37

CLK t CKS t CKH CKE t CKS t CKH t CMS t CMH COMMAND READ NOP t CMS t CMH DQM A0-A9 2 COLUMN ...

Page 38

T0 T1 CLK t CK CKE t CKS t CKH t CMS t CMH COMMAND PRECHARGE NOP DQM ADDRESS BANK(S) High Precharge all active banks. TIMING PARAMETERS -8B SYMBOL* MIN MAX t AH ...

Page 39

T0 T1 CLK t CK CKE t CKS t CKH t CMS t CMH COMMAND PRECHARGE DQM ADDRESS BANK(S) High Precharge all active banks. TIMING PARAMETERS -8B SYMBOL* MIN MAX ...

Page 40

CLK t CKS t CKH CKE t CMS t CMH COMMAND ACTIVE NOP t CMS DQM A0-A9 ROW ROW A10 DISABLE AUTO PRECHARGE ...

Page 41

CLK t CKS t CKH CKE t CMS t CMH COMMAND ACTIVE NOP t CMS DQM A0-A9 ROW ENABLE AUTO PRECHARGE ROW A10 ...

Page 42

ALTERNATING BANK READ ACCESSES CLK t CKS t CKH CKE t CMS t CMH COMMAND ACTIVE NOP t CMS DQM A0-A9 ROW ENABLE AUTO PRECHARGE ROW ...

Page 43

CLK CKS t CKH CKE t CMS t CMH COMMAND ACTIVE NOP READ t CMS DQM A0-A9 ROW COLUMN ROW A10 ...

Page 44

CLK t CKS t CKH CKE t CMS t CMH COMMAND ACTIVE NOP DQM A0-A9 ROW ENABLE AUTO PRECHARGE ROW A10 DISABLE AUTO PRECHARGE ...

Page 45

WRITE – WITHOUT AUTO PRECHARGE CLK t CKS t CKH CKE t CMS t CMH COMMAND ACTIVE NOP t CMS DQM A0-A9 ROW ROW A10 DISABLE AUTO PRECHARGE ...

Page 46

CLK t CKS t CKH CKE t CMS t CMH COMMAND ACTIVE NOP WRITE t CMS DQM COLUMN m 3 A0-A9 ROW ENABLE AUTO PRECHARGE ...

Page 47

ALTERNATING BANK WRITE ACCESSES CLK t CKS t CKH CKE t CMS t CMH COMMAND ACTIVE NOP t CMS DQM A0-A9 ROW ENABLE AUTO PRECHARGE ROW ...

Page 48

CLK CKS t CKH CKE t CMS t CMH COMMAND ACTIVE NOP DQM A0-A9 ROW ROW A10 BANK DQ t ...

Page 49

CLK t CKS t CKH CKE t CMS t CMH COMMAND ACTIVE NOP DQM A0-A9 ROW ROW A10 BANK DQ t RCD TIMING ...

Page 50

PIN #1 ID .0315 (0.80) TYP NOTE: 1. All dimensions in inches (millimeters) 2. Package width and length do not include mold protrusion; allowable mold protrusion is .01" per side. 16 Meg: x4, x8 ...

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