BGY835C,112 NXP Semiconductors, BGY835C,112 Datasheet
BGY835C,112
Specifications of BGY835C,112
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BGY835C,112 Summary of contents
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BGY835C CATV amplifier module Rev. 2 — 28 September 2010 1. Product profile 1.1 General description Hybrid high dynamic range amplifier module operating at a supply voltage (DC SOT115J package. The module consists of two ...
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... NXP Semiconductors 2. Pinning information Table 2. Pin Ordering information Table 3. Type number BGY835C 4. Limiting values Table 4. In accordance with the Absolute Maximum Rating System (IEC 60134). Symbol stg T mb BGY835C Product data sheet Pinning Description input common common +V B common common output ...
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... NXP Semiconductors 5. Characteristics Table 5. Characteristics Bandwidth 40 MHz to 860 MHz; V Symbol Parameter G power gain p SL slope cable equivalent FL flatness of frequency response RL input return loss in RL output return loss out phase response s21 CTB composite triple beat CSO composite second-order distortion NF noise figure ...
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... NXP Semiconductors 6. Package outline Rectangular single-ended package; aluminium flange; 2 vertical mounting holes 6-32 UNC and 2 extra horizontal mounting holes; 7 gold-plated in-line leads DIMENSIONS (mm are the original dimensions UNIT b c max. max. max. 0.51 mm 20.8 9.5 0.25 27.2 0.38 OUTLINE VERSION IEC SOT115J Fig 1 ...
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... NXP Semiconductors 7. Abbreviations Table 6. Acronym CATV DC UNC 8. Revision history Table 7. Revision history Document ID Release date BGY835C v.2 20100928 • Modifications: • BGY835C v.1 20080908 BGY835C Product data sheet Abbreviations Description Community Antenna TeleVision Direct Current UNified Coarse Data sheet status Product data sheet Package outline drawings have been updated to the latest version ...
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... In no event shall NXP Semiconductors be liable for any indirect, incidental, punitive, special or consequential damages (including - without limitation - lost profits, lost savings, business interruption, costs related to the removal or ...
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... NXP Semiconductors’ specifications such use shall be solely at customer’s own risk, and (c) customer fully indemnifies NXP Semiconductors for any liability, damages or failed product claims resulting from customer design and use of the product for automotive applications beyond NXP Semiconductors’ ...
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... NXP Semiconductors 11. Contents 1 Product profile . . . . . . . . . . . . . . . . . . . . . . . . . . 1 1.1 General description . . . . . . . . . . . . . . . . . . . . . 1 1.2 Features and benefits . . . . . . . . . . . . . . . . . . . . 1 1.3 Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 1.4 Quick reference data . . . . . . . . . . . . . . . . . . . . 1 2 Pinning information . . . . . . . . . . . . . . . . . . . . . . 2 3 Ordering information . . . . . . . . . . . . . . . . . . . . . 2 4 Limiting values Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . 3 6 Package outline . . . . . . . . . . . . . . . . . . . . . . . . . 4 7 Abbreviations . . . . . . . . . . . . . . . . . . . . . . . . . . . 5 8 Revision history . . . . . . . . . . . . . . . . . . . . . . . . . 5 9 Legal information 9.1 Data sheet status . . . . . . . . . . . . . . . . . . . . . . . 6 9 ...