BGD712C,112 NXP Semiconductors, BGD712C,112 Datasheet
BGD712C,112
Specifications of BGD712C,112
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BGD712C,112 Summary of contents
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BGD712C 750 MHz, 18.5 dB gain power doubler amplifier Rev. 3 — 29 September 2010 1. Product profile 1.1 General description Hybrid high dynamic range amplifier module in SOT115J package operating at a supply voltage (DC). CAUTION ...
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... NXP Semiconductors 2. Pinning information Table 2. Pin Ordering information Table 3. Type number BGD712C 4. Limiting values Table 4. In accordance with the Absolute Maximum Rating System (IEC 60134). Symbol stg T mb BGD712C Product data sheet 750 MHz, 18.5 dB gain power doubler amplifier Pinning Description ...
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... NXP Semiconductors 5. Characteristics Table 5. Characteristics Bandwidth 40 MHz to 750 MHz; V Symbol Parameter G power gain p SL slope cable equivalent FL flatness of frequency response S input return losses 11 S output return losses 22 ϕ phase response s21 CTB composite triple beat CSO composite second-order distortion NF noise figure ...
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... NXP Semiconductors 6. Package outline Rectangular single-ended package; aluminium flange; 2 vertical mounting holes 6-32 UNC and 2 extra horizontal mounting holes; 7 gold-plated in-line leads DIMENSIONS (mm are the original dimensions UNIT b c max. max. max. 0.51 mm 20.8 9.5 0.25 27.2 0.38 OUTLINE VERSION IEC SOT115J Fig 1 ...
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... Data sheet status Product data sheet The format of this data sheet has been redesigned to comply with the new identity guidelines of NXP Semiconductors. Legal texts have been adapted to the new company name where appropriate. Package outline drawings have been updated to the latest version. ...
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... In no event shall NXP Semiconductors be liable for any indirect, incidental, punitive, special or consequential damages (including - without limitation - lost profits, lost savings, business interruption, costs related to the removal or ...
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... NXP Semiconductors’ specifications such use shall be solely at customer’s own risk, and (c) customer fully indemnifies NXP Semiconductors for any liability, damages or failed product claims resulting from customer design and use of the product for automotive applications beyond NXP Semiconductors’ ...
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... NXP Semiconductors 10. Contents 1 Product profile . . . . . . . . . . . . . . . . . . . . . . . . . . 1 1.1 General description . . . . . . . . . . . . . . . . . . . . . 1 1.2 Features and benefits . . . . . . . . . . . . . . . . . . . . 1 1.3 Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 1.4 Quick reference data . . . . . . . . . . . . . . . . . . . . 1 2 Pinning information . . . . . . . . . . . . . . . . . . . . . . 2 3 Ordering information . . . . . . . . . . . . . . . . . . . . . 2 4 Limiting values Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . 3 6 Package outline . . . . . . . . . . . . . . . . . . . . . . . . . 4 7 Revision history . . . . . . . . . . . . . . . . . . . . . . . . . 5 8 Legal information 8.1 Data sheet status . . . . . . . . . . . . . . . . . . . . . . . 6 8 ...