BGD704/09,112 NXP Semiconductors, BGD704/09,112 Datasheet
BGD704/09,112
Specifications of BGD704/09,112
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BGD704/09,112 Summary of contents
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BGD704 750 MHz gain power doubler amplifier Rev. 8 — 28 September 2010 1. Product profile 1.1 General description Hybrid amplifier module in a SOT115J package operating with a voltage supply (DC). CAUTION This device ...
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... NXP Semiconductors 2. Pinning information Table 2. Pin Ordering information Table 3. Type number BGD704 4. Limiting values Table 4. In accordance with the Absolute Maximum Rating System (IEC 60134). Symbol Parameter stg Characteristics Table 5. Characteristics Bandwidth 40 MHz to 750 MHz; V Symbol Parameter G power gain p SL slope cable equivalent ...
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... NXP Semiconductors Table 5. Characteristics …continued Bandwidth 40 MHz to 750 MHz; V Symbol Parameter s output return losses 22 s phase response 21 CTB composite triple beat X cross modulation mod CSO composite second order distortion 110 channels flat second order distortion 2 V output voltage o F noise figure ...
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... NXP Semiconductors Table 6. Characteristics …continued Bandwidth 40 MHz to 600 MHz; V Symbol Parameter CTB composite triple beat X cross modulation mod CSO composite second order distortion d second order distortion 2 V output voltage o F noise figure I total current consumption (DC) tot [ 55.25 MHz dBmV [2] Measured according to DIN45004B; f − ...
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... NXP Semiconductors [2] Measure according to DIN45004B; f − f measured 538.25 MHz [3] The module normally operates at V Table 8. Characteristics Bandwidth 40 MHz to 450 MHz; V Symbol Parameter G power gain p SL slope cable equivalent FL flatness of frequency response MHz to 450 MHz s input return losses 11 s output return losses ...
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... NXP Semiconductors 6. Package outline Rectangular single-ended package; aluminium flange; 2 vertical mounting holes 6-32 UNC and 2 extra horizontal mounting holes; 7 gold-plated in-line leads DIMENSIONS (mm are the original dimensions UNIT b c max. max. max. 0.51 mm 20.8 9.5 0.25 27.2 0.38 OUTLINE VERSION IEC SOT115J Fig 1 ...
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... Modifications: The format of this data sheet has been redesigned to comply with the new identity guidelines of NXP Semiconductors. • Legal texts have been adapted to the new company name where appropriate. • Package outline drawings have been updated to the latest version. ...
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... In no event shall NXP Semiconductors be liable for any indirect, incidental, punitive, special or consequential damages (including - without limitation - lost profits, lost savings, business interruption, costs related to the removal or ...
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... NXP Semiconductors’ specifications such use shall be solely at customer’s own risk, and (c) customer fully indemnifies NXP Semiconductors for any liability, damages or failed product claims resulting from customer design and use of the product for automotive applications beyond NXP Semiconductors’ ...
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... NXP Semiconductors 10. Contents 1 Product profile . . . . . . . . . . . . . . . . . . . . . . . . . . 1 1.1 General description . . . . . . . . . . . . . . . . . . . . . 1 1.2 Features and benefits . . . . . . . . . . . . . . . . . . . . 1 1.3 Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 1.4 Quick reference data . . . . . . . . . . . . . . . . . . . . 1 2 Pinning information . . . . . . . . . . . . . . . . . . . . . . 2 3 Ordering information . . . . . . . . . . . . . . . . . . . . . 2 4 Limiting values Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . 2 6 Package outline . . . . . . . . . . . . . . . . . . . . . . . . . 6 7 Revision history . . . . . . . . . . . . . . . . . . . . . . . . . 7 8 Legal information 8.1 Data sheet status . . . . . . . . . . . . . . . . . . . . . . . 8 8 ...