CGD914,112 NXP Semiconductors, CGD914,112 Datasheet
CGD914,112
Specifications of CGD914,112
CGD914
CGD914
Related parts for CGD914,112
CGD914,112 Summary of contents
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DATA SHEET handbook, halfpage CGD914; CGD914MI 860 MHz gain power doubler amplifier Product specification Supersedes data of 2000 Jul 25 DISCRETE SEMICONDUCTORS M3D252 2001 Nov 01 ...
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... NXP Semiconductors 860 MHz gain power doubler amplifier FEATURES Excellent linearity Extremely low noise Excellent return loss properties Rugged construction Gold metallization ensures excellent reliability. APPLICATIONS CATV systems operating in the 40 to 870 MHz frequency range. ...
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... NXP Semiconductors 860 MHz gain power doubler amplifier CHARACTERISTICS Bandwidth 45 to 870 MHz SYMBOL PARAMETER G power gain p SL slope straight line FL flatness straight line flatness narrow band s input return losses 11 s output return losses 22 s phase response 21 s reverse isolation 12 CTB ...
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... NXP Semiconductors 860 MHz gain power doubler amplifier SYMBOL PARAMETER CSO Sum composite second order distortion (sum) CSO Diff composite second order distortion (diff) NF noise figure d second order distortion 2 V output voltage o I total current tot consumption (DC) Notes dBmV at 54 MHz; Tilt = 7.3 dB (55 to 547 MHz) extrapolated 870 MHz. ...
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... NXP Semiconductors 860 MHz gain power doubler amplifier −60 handbook, halfpage CTB (dB) −70 −80 −90 −100 0 200 400 600 = 75 chs; tilt = 7.3 dB (50 to 550 MHz ( (3) Typ. o (2) Typ. +3 . (4) Typ. 3 . Fig.2 Composite triple beat as a function of frequency under tilted conditions. ...
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... NXP Semiconductors 860 MHz gain power doubler amplifier −60 handbook, halfpage CTB (dB) −70 −80 −90 0 200 400 = 75 chs flat (50 to 550 MHz ( (3) Typ. o (2) Typ. +3 . (4) Typ. 3 . Fig.6 Composite triple beat as a function of frequency under flat conditions. −50 ...
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... NXP Semiconductors 860 MHz gain power doubler amplifier −40 handbook, halfpage CTB (dB) −50 −60 −70 −80 0 200 400 600 = 75 112 chs; tilt = 10.2 dB (50 to 750 MHz ( (3) Typ. o (2) Typ. +3 . (4) Typ. 3 . Fig.10 Composite triple beat as a function of frequency under tilted conditions. ...
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... NXP Semiconductors 860 MHz gain power doubler amplifier −50 handbook, halfpage CTB (dB) −60 −70 −80 −90 0 200 400 = 75 112 chs flat (50 to 750 MHz ( (3) Typ. o (2) Typ. +3 . (4) Typ. 3 . Fig.14 Composite triple beat as a function of frequency under flat conditions. ...
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... NXP Semiconductors 860 MHz gain power doubler amplifier −40 handbook, halfpage CTB (dB) −50 −60 −70 −80 0 200 400 = 75 132 chs; tilt = 12 dB (50 to 870 MHz ( (3) Typ. o (2) Typ. +3 . (4) Typ. 3 . Fig.18 Composite triple beat as a function of frequency under tilted conditions. ...
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... NXP Semiconductors 860 MHz gain power doubler amplifier −40 handbook, halfpage CTB (dB) −50 −60 −70 −80 0 200 400 = 75 132 chs flat (50 to 870 MHz ( (3) Typ. o (2) Typ. +3 . (4) Typ. 3 . Fig.22 Composite triple beat as a function of frequency under flat conditions. ...
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... NXP Semiconductors 860 MHz gain power doubler amplifier PACKAGE OUTLINE Rectangular single-ended package; aluminium flange; 2 vertical mounting holes 6-32 UNC and 2 extra horizontal mounting holes; 7 gold-plated in-line leads DIMENSIONS (mm are the original dimensions UNIT b c max. max. max. 0.51 mm 20.8 9.5 ...
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... In no event shall NXP Semiconductors be liable for any indirect, incidental, punitive, special or consequential damages (including - without limitation - lost profits, lost savings, business interruption, costs related to the ...
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... NXP Semiconductors’ specifications such use shall be solely at customer’s own risk, and (c) customer fully indemnifies NXP Semiconductors for any liability, damages or failed product claims resulting from customer design and use of the product for automotive applications beyond NXP Semiconductors’ ...
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... Interface, Security and Digital Processing expertise Customer notification This data sheet was changed to reflect the new company name NXP Semiconductors, including new legal definitions and disclaimers. No changes were made to the technical content, except for package outline drawings which were updated to the latest version. ...