TDA7333013TR STMicroelectronics, TDA7333013TR Datasheet - Page 24

• Manufacturer Part Number: TDA7333013TR
• Description: IC PROCESSOR RDS/RBDS 16-TSSOP
• Manufacturer: STMicroelectronics
• Type: RDS/RBDS Signal Processorr

Specifications of TDA7333013TR

• Applications: Radio
• Mounting Type: Surface Mount
• Package / Case: 16-TSSOP
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant

Package information
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Package information
In order to meet environmental requirements, ST (also) offers these devices in ECOPACK®
packages. ECOPACK® packages are lead-free. The category of second Level Interconnect
is marked on the package and on the inner box label, in compliance with JEDEC Standard
JESD97. The maximum ratings related to soldering conditions are also marked on the inner
box label.
ECOPACK is an ST trademark. ECOPACK specifications are available at: www.st.com.
Figure 25. TSSOP16 mechanical data and package dimensions
E1 (1) 4.300
Note: 1. D and E1 does not include mold flash or protrusions.
D (1)
DIM.
aaa
A1
A2
L1
A
E
b
c
e
L
k
0.050
0.800
0.190
0.090
4.900
6.200
0.450
MIN.
Mold flash or potrusions shall not exceed 0.15mm
(.006inch) per side.
1.000
5.000
6.400
4.400
0.650
0.600
1.000
TYP.
mm
0˚ (min.) 8˚ (max.)
MAX.
1.200
0.150
1.050
0.300
0.200
5.100
6.600
4.500
0.750
0.100
0.002
0.031
0.007
0.005
0.114
0.244
0.170
0.018
MIN.
0.039
0.118
0.252
0.173
0.026
0.024
0.039
inch
TYP.
MAX.
0.047
0.006
0.041
0.012
0.009
0.122
0.260
0.177
0.030
0.004
MECHANICAL DATA
(Body 4.4mm)
OUTLINE AND
TSSOP16
0080338 (Jedec MO-153-AB)
TDA7333