TDA1517ATW NXP Semiconductors, TDA1517ATW Datasheet - Page 14

• Manufacturer Part Number: TDA1517ATW
• Manufacturer: NXP Semiconductors

NXP Semiconductors
PACKAGE OUTLINE
2001 Apr 17
HTSSOP20: plastic thermal enhanced thin shrink small outline package; 20 leads;
body width 4.4 mm; exposed die pad
8 W BTL or 2 × 4 W SE power amplifier
DIMENSIONS (mm are the original dimensions)
Notes
1. Plastic or metal protrusions of 0.15 mm maximum per side are not included.
2. Plastic interlead protrusions of 0.25 mm maximum per side are not included.
UNIT
mm
VERSION
OUTLINE
SOT527-1
max.
1.1
A
0.15
0.05
A 1
Z
20
1
0.95
0.80
y
A 2
IEC
pin 1 index
0.25
A 3
exposed die pad side
e
0.30
0.19
b p
D h
D
0.20
0.09
c
MO-153
JEDEC
D
b p
6.6
6.4
(1)
REFERENCES
0
11
10
D h
4.3
4.1
w
E h
M
E
4.5
4.3
(2)
JEITA
scale
2.5
14
c
E h
3.1
2.9
A
2
0.65
A
e
1
5 mm
H E
6.6
6.2
H
E
E
L
1
detail X
0.75
0.50
L p
L
L
PROJECTION
EUROPEAN
p
0.2
v
A
(A )
3
0.13
w
TDA1517ATW
X
θ
Product specification
v
A
0.1
M
y
ISSUE DATE
A
03-04-07
05-11-02
Z
0.5
0.2
(1)
SOT527-1
θ
8
0
o
o