BAV756S_BAW56_SER NXP Semiconductors, BAV756S_BAW56_SER Datasheet - Page 9

• Manufacturer Part Number: BAV756S_BAW56_SER
• Description: High-speed switching diodes, encapsulated in small Surface-Mounted Device (SMD)plastic packages
• Manufacturer: NXP Semiconductors

NXP Semiconductors
10. Packing information
11. Soldering
BAV756S_BAW56_SER_5
Product data sheet
Table 9.
The indicated -xxx are the last three digits of the 12NC ordering code.
[1]
[2]
[3]
Type number Package
BAV756S
BAW56
BAW56M
BAW56S
BAW56T
BAW56W
Fig 12. Reflow soldering footprint BAW56 (SOT23/TO-236AB)
For further information and the availability of packing methods, see
T1: normal taping
T2: reverse taping
3.00
Packing methods
0.85
0.85
SOT363
SOT23
SOT883
SOT363
SOT416
SOT323
1.30
Rev. 05 — 26 November 2007
2
Description
4 mm pitch, 8 mm tape and reel; T1
4 mm pitch, 8 mm tape and reel; T2
4 mm pitch, 8 mm tape and reel
2 mm pitch, 8 mm tape and reel
4 mm pitch, 8 mm tape and reel; T1
4 mm pitch, 8 mm tape and reel; T2
4 mm pitch, 8 mm tape and reel
4 mm pitch, 8 mm tape and reel
2.90
2.50
1.00
3.30
3
BAV756S; BAW56 series
0.50 (3x)
0.60 (3x)
1
0.60
(3x)
sot023
2.70
Section
High-speed switching diodes
[1]
Dimensions in mm
14.
[2]
[3]
[2]
[3]
solder lands
solder resist
solder paste
occupied area
Packing quantity
3000
-115
-125
-215
-
-115
-125
-115
-115
© NXP B.V. 2007. All rights reserved.
10000
-135
-165
-235
-315
-135
-165
-135
-135
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