LH79524_LH79525_N NXP Semiconductors, LH79524_LH79525_N Datasheet - Page 58
![no-image](/images/manufacturer_photos/0/4/487/nxp_semiconductors_sml.jpg)
LH79524_LH79525_N
Manufacturer Part Number
LH79524_LH79525_N
Description
The LH79524/LH79525, powered by an ARM720T,is a complete System-on-Chip with a high level of integrationto satisfy a wide range of requirements andapplications
Manufacturer
NXP Semiconductors
Datasheet
1.LH79524_LH79525_N.pdf
(64 pages)
- Current page: 58 of 64
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LH79524/LH79525
58
LFBGA208: plastic low profile fine-pitch ball grid array package; 208 balls
DIMENSIONS (mm are the original dimensions)
UNIT
mm
SOT1019-1
OUTLINE
VERSION
max
1.7
A
ball A1
index area
ball A1
index area
0.4
0.3
A
1
M
T
P
K
H
F
D
B
R
N
G
C
L
J
E
A
1.35
1.20
A
2
1
IEC
2
0.5
0.4
b
3
Figure 42. Package outline SOT1019-1 (LFBGA208)
4
14.1
13.9
5
D
e
6
7
14.1
13.9
8
JEDEC
E
e
D
1
9
10
REFERENCES
1/2 e
0.8
11
e
NXP Semiconductors
0
Rev. 01 — 16 July 2007
12
13
e
12
14
1
b
15
16
JEITA
e
12
2
scale
5
1/2 e
0.15
B
e
v
∅ v
∅ w
e
A
E
M
M
2
0.08
w
C
C
A
10 mm
0.12
y
B
A
A
0.1
2
y
1
A
y
1
1
C
PROJECTION
EUROPEAN
detail X
Preliminary data sheet
C
X
y
System-on-Chip
ISSUE DATE
07-07-07
07-07-07
SOT1019-1
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