LPC2101_02_03 NXP Semiconductors, LPC2101_02_03 Datasheet - Page 27

• Manufacturer Part Number: LPC2101_02_03
• Description: The LPC2101/02/03 microcontrollers are based on a 16-bit/32-bit ARM7TDMI-S CPU withreal-time emulation that combines the microcontroller with 8 kB, 16 kB or 32 kB ofembedded high-speed flash memory
• Manufacturer: NXP Semiconductors

NXP Semiconductors
LPC2101_02_03_4
Product data sheet
8.1 Power consumption in Deep power-down mode
Fig 6.
Fig 7.
I
DD(CORE)
( A
( A
I
BAT
1.25
0.75
12.5
1.5
0.5
7.5
Test conditions: Deep power-down mode entered; RTC off; SRAM off;
V
Core supply current I
voltages
15
10
Test conditions: Deep power-down mode entered; V
V
Battery supply current I
1
5
i(VBAT)
DD(3V3)
40
40
= V
= V
DD(3V3)
DDA
= 3.3 V.
Rev. 04 — 2 June 2009
= V
15
15
DDA
DD(CORE)
= 3.3 V.
BAT
measured at different temperatures and conditions
10
10
measured at different temperatures and supply
Single-chip 16-bit/32-bit microcontrollers
V
RTC on; SRAM on
RTC on; SRAM off
DD(1V8)
35
35
i(BAT)
=1.8 V
= 3.3 V; V
1.7 V
LPC2101/02/03
RTC off; SRAM on
RTC off; SRAM off
DD(1V8)
60
60
Temperature ( C)
Temperature ( C)
1.65 V
= 1.8 V;
002aae680
002aae681
© NXP B.V. 2009. All rights reserved.
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