TS507 STMicroelectronics, TS507 Datasheet - Page 17
TS507
Manufacturer Part Number
TS507
Description
High precision single supply rail to rail op-amp
Manufacturer
STMicroelectronics
Datasheet
1.TS507.pdf
(20 pages)
Specifications of TS507
Ultra Low Offset Voltage
25μV typ, 100μV max
High Speed
1.9MHz
Low Consumption
0.8mA at 2.7V
Very Large Signal Voltage Gain
131dB
High Power Supply Rejection Ratio
105dB
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Part Number:
TS5070
Manufacturer:
ST
Quantity:
20 000
Company:
Part Number:
TS5070 PLCC
Manufacturer:
ST
Quantity:
424
Company:
Part Number:
TS5070FN
Manufacturer:
ST
Quantity:
5 510
Part Number:
TS5070FN
Manufacturer:
ST
Quantity:
20 000
TS507
4
4.1
Package information
In order to meet environmental requirements, STMicroelectronics offers these devices in
ECOPACK
category of second level interconnect is marked on the package and on the inner box label,
in compliance with JEDEC Standard JESD97. The maximum ratings related to soldering
conditions are also marked on the inner box label. ECOPACK is an STMicroelectronics
trademark. ECOPACK specifications are available at: www.st.com.
SOT23-5 package information
Figure 31. SOT23-5 package mechanical drawing
Table 7.
Ref.
A1
A2
E1
e1
A
C
D
E
b
e
L
®
packages. These packages have a lead-free second level interconnect. The
SOT23-5 package mechanical data
Min.
0.90
0.00
0.90
0.35
0.09
2.80
2.60
1.50
0.35
Millimeters
Typ.
0.95
1.9
Max.
1.45
0.15
1.30
0.50
0.20
3.00
3.00
1.75
0.55
Dimensions
110.2
102.3
Min.
35.4
0.00
35.4
13.7
59.0
13.7
3.5
Package information
Typ.
Mils
37.4
74.8
118.1
118.1
Max.
57.1
51.2
19.7
68.8
21.6
5.9
7.8
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