TS274 STMicroelectronics, TS274 Datasheet - Page 10

• Manufacturer Part Number: TS274
• Description: Micropower, wide range of input offset voltage
• Manufacturer: STMicroelectronics

Specifications of TS274

• Gain Bandwidth Product: 3.5MHz

Package information
5
5.1
10/14
Package information
In order to meet environmental requirements, ST offers these devices in ECOPACK
packages. These packages have a lead-free second level interconnect. The category of
second level interconnect is marked on the package and on the inner box label, in
compliance with JEDEC Standard JESD97. The maximum ratings related to soldering
conditions are also marked on the inner box label. ECOPACK is an ST trademark.
ECOPACK specifications are available at:
DIP14 package information
Figure 15. DIP14 package mechanical drawing
Table 5.
Ref.
a1
b1
e3
B
D
E
b
e
F
L
Z
I
DIP14 package mechanical data
Min.
0.51
1.39
1.27
Millimeters
15.24
Typ.
0.25
2.54
0.5
8.5
3.3
www.st.com.
Max.
1.65
2.54
7.1
5.1
20
0.020
0.055
0.050
Min.
Inches
0.020
0.010
0.335
0.100
0.600
0.130
Typ.
0.065
0.787
0.280
0.201
0.100
Max.
®
TS274