STPS2L25 STMicroelectronics, STPS2L25 Datasheet
STPS2L25
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STPS2L25 Summary of contents
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... Parameter = 125° C δ = 0.5 SMB 135° C δ = 0.5 SMB flat sinusoidal µ 25° (1) Rev 5 STPS2L25 A K SMB STPS2L25U A K SMB flat STPS2L25UF Value Unit 1500 W - 150 °C 150 °C 1/9 www.st.com 9 ...
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... SMB flat Test Conditions T = 25° RRM T = 125° 25° 125° 25° 125° (RMS) STPS2L25 Value Unit 25 °C/W 15 Min. Typ. Max. Unit 90 µ 0.45 0.325 0.375 V 0.53 0.43 0.51 ...
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... STPS2L25 Figure 1. Average forward power dissipation versus average forward current P (W) F(AV) 1.2 δ = 0.2 δ = 0.1 1.1 δ = 0.05 1.0 0.9 0.8 0.7 0.6 0.5 0.4 0.3 0.2 0.1 I (A) F(AV) 0.0 0.0 0.2 0.4 0.6 0.8 1.0 1.2 1.4 Figure 3. Average forward current versus ambient temperature (δ = 0.5) SMB flat I (A) F(AV) 2 th(j-a) th(j-l) 2.0 1.8 1.6 R =100°C/W th(j-a) 1.4 1.2 1.0 0.8 0.6 T 0.4 0.2 T (°C) δ amb tp =tp/T 0 Figure 5. Non repetitive surge peak forward ...
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... SMB /R th(j-a) t (s) p 1.E-01 1.E+00 1.E+01 1.E+02 reverse voltage applied (typical values) I (mA =150° =125° =100° =25° ( forward current (typical values) (A) T =125° =150° =25° (V) FM 0.1 0.2 0.3 0.4 STPS2L25 T δ =tp/T tp 1.E+ 0.5 0.6 ...
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... STPS2L25 Figure 13. Forward voltage drop versus forward current (maximum values, high level) I ( =125 °C =125 ° (maximum values) (maximum values) 1.0 T =125 °C j (typical values) 0.1 0.0 0.1 0.2 0.3 0.4 Figure 15. Thermal resistance junction to ambient versus copper surface under each lead (epoxy printed board FR4, e =35µ ...
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... Package information 2 Package information ● Epoxy meets UL94, V0 Table 4. SMB dimensions Figure 16. SMB footprint (dimensions in mm) 6/9 Ref 1.62 2.60 1.62 5.84 STPS2L25 Dimensions Millimeters Inches Min. Max. Min. Max. 1.90 2.45 0.075 0.096 0.05 0.20 0.002 0.008 1.95 2.20 0.077 0.087 0.15 0.40 0.006 0.016 5.10 5.60 0.201 0.220 4.05 4.60 ...
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... STPS2L25 Table 5. SMB Flat dimensions Applies to plated leads Figure 17. SMB Flat footprint (dimensions in mm) In order to meet environmental requirements, ST offers these devices in ECOPACK® packages. These packages have a lead-free second level interconnect. The category of second level interconnect is marked on the package and on the inner box label, in compliance with JEDEC Standard JESD97 ...
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... Revision history Date July 2003 08-Feb-2007 8/9 Marking Package G23 SMB FG23 SMB flat Revision 4A Last update Reformatted to current standard. Added ECOPACK 5 statement. Added SMB flat package. STPS2L25 Weight Base qty Delivery mode 0.107 g 2500 Tape and reel 0.50 g 5000 Tape and reel Changes ...
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... STPS2L25 Information in this document is provided solely in connection with ST products. STMicroelectronics NV and its subsidiaries (“ST”) reserve the right to make changes, corrections, modifications or improvements, to this document, and the products and services described herein at any time, without notice. All ST products are sold pursuant to ST’s terms and conditions of sale. ...