STPS340 STMicroelectronics, STPS340 Datasheet

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STPS340

Manufacturer Part Number
STPS340
Description
Power Schottky Rectifier
Manufacturer
STMicroelectronics
Datasheet

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Main product characteristics
Features and Benefits
Description
Single chip Schottky rectifier suited for switch
mode power supplies and high frequency DC to
DC converters.
Packaged in DPAK, SMC, SMB, and low profile
SMB, this device is intended for use in low and
medium voltage operation, high frequency
inverters, free wheeling and polarity protection
applications where low switching losses are
required.
February 2007
Very small conduction losses
Negligible switching losses
Low forward voltage drop
Low thermal resistance
Extremely fast switching
Surface mounted device
Avalanche capability specified
V
T
F
V
I
j
F(AV)
(max)
RRM
(max)
150° C
0.57 V
40 V
3 A
Rev 9
Order codes
STPS340B-TR
Part Number
STPS340U
STPS340UF
K
STPS340U
STPS340S
STPS340B
SMB
Power Schottky rectifier
A
STPS340UF
STPS340B
K
SMB flat
K
DPAK
NC
A
A
STPS340
STPS340S
K
Marking
S340
FU34
SMC
S340
U34
S34
A
www.st.com
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STPS340 Summary of contents

Page 1

... February 2007 150° C 0.57 V Order codes Part Number STPS340B-TR Rev 9 STPS340 Power Schottky rectifier DPAK STPS340B SMB SMC STPS340U STPS340S A K SMB flat STPS340UF Marking STPS340U U34 STPS340S S34 STPS340B S340 S340 STPS340UF FU34 A 1/11 www.st.com 11 ...

Page 2

... Value 40 DPAK 6 DPAK SMB/SMC 3 SMB flat 75 = 25° C 1300 j - 150 150 Value SMB 25 SMB flat 15 SMC 20 DPAK 5.5 Min. Typ. Max RRM 0.52 0.57 0. 0.63 0.72 STPS340 Unit °C °C Unit °C/W °C/W Unit µ ...

Page 3

... STPS340 Figure 1. Average forward power dissipation versus average forward current (per diode) P (W) F(AV) 2.5 δ = 0.1 δ = 0.2 δ = 0.05 2.0 1.5 1.0 0.5 I (A) F(AV) 0.0 0.0 0.5 1.0 1.5 2.0 Figure 3. Average forward current versus ambient temperature (δ = 0.5, per diode) (SMB flat) I (A) F(AV) 3 th(j-a) th(j-l) 3.0 2.5 2.0 1.5 1.0 T 0.5 T (°C) δ amb =tp Figure 5. Non repetitive surge peak forward ...

Page 4

... Figure 12. Relative variation of thermal Z th(j-a) 1.0 0.9 SMC 0.8 0.7 0.6 0.5 0.4 0.3 T 0.2 Single pulse 0.1 δ tp =tp/T 0.0 1.E+02 1.E+03 1.E-02 Normalized avalanche power derating versus pulse duration (t ) ARM p (1µs) t (µ impedance junction to ambient versus pulse duration (DPAK) /R th(j-a) DPAK t (s) p 1.E-02 1.E-01 impedance junction to ambient versus pulse duration (SMC) /R th(j-a) t (s) p 1.E-01 1.E+00 1.E+01 1.E+02 STPS340 100 1000 T δ =tp/T tp 1.E+00 T δ tp =tp/T 1.E+03 ...

Page 5

... STPS340 Figure 13. Relative variation of thermal impedance junction to lead versus pulse duration - SMB flat Z /R th(j-l) th(j-l) 1.0 SMB flat 0.9 0.8 0.7 0.6 0.5 0.4 0.3 0.2 Single pulse 0.1 t (s) p 0.0 1.E-04 1.E-03 1.E-02 1.E-01 Figure 15. Junction capacitance versus reverse voltage applied (typical values) C(pF) 1000 100 V ( Figure 17. Thermal resistance junction to ambient versus copper surface ...

Page 6

... Dimensions Ref Millimeters Min. Max. Min. A 2.20 2.40 0.086 A1 0.90 1.10 0.035 A2 0.03 0.23 0.001 B 0.64 0.90 0.025 B2 5.20 5.40 0.204 C 0.45 0.60 0.017 C2 0.48 0.60 0.018 D 6.00 6.20 0.236 E 6.40 6.60 0.251 G 4.40 4.60 0.173 H 9.35 10.10 0.368 L2 0.80 typ. L4 0.60 1.00 0.023 V2 0° 8° 0° STPS340 Inches Max. 0.094 0.043 0.009 0.035 0.212 0.023 0.023 0.244 0.259 0.181 0.397 0.031 typ. 0.039 8° ...

Page 7

... STPS340 Figure 20. DPAK footprint dimensions (in millimeters) Table 5. SMB dimensions Figure 21. SMB footprint (dimensions in mm) 6.7 3 6.7 Ref 1.62 2.60 1.62 5.84 Package Information 1.6 3 2.3 2.3 1.6 Dimensions Millimeters Inches Min. Max. Min. 1.90 2.45 0.075 0.05 0.20 0.002 1.95 2.20 0.077 0.15 0.40 0.006 5.10 5.60 0.201 4.05 4.60 0.159 3.30 3.95 0.130 0.75 1.50 0.030 2.18 Max. 0.096 0.008 ...

Page 8

... Applies to plated leads Figure 22. SMB Flat footprint (dimensions in mm) 8/11 Ref ( ( 5.84 1.20 3.44 1.20 STPS340 Dimensions Millimeters Inches Min. Typ. Max. Min. Typ. 0.90 1.10 0.035 1.95 2.20 0.077 0.15 0.40 0.006 3.30 3.95 0.130 5.10 5.60 0.200 4.05 4.60 0.189 0.75 1.50 0.029 0.40 0.016 0.60 0.024 2.07 Max. 0.043 0.087 ...

Page 9

... STPS340 Table 7. SMC package mechanical data Figure 23. Foot print dimensions (in millimeters) In order to meet environmental requirements, ST offers these devices in ECOPACK® packages. These packages have a lead-free second level interconnect. The category of second level interconnect is marked on the package and on the inner box label, in compliance with JEDEC Standard JESD97 ...

Page 10

... Ordering information 3 Ordering information Ordering type STPS340U STPS340S STPS340B STPS340B-TR STPS340UF 4 Revision history Date Jul-2003 Feb-2005 08-Feb-2007 10/11 Marking Package U34 SMB S34 SMC S340 DPAK FU34 SMB flat Revision Description of Changes 7B Last update. 8 Layout update. No content change. Reformatted to current standard. Added ECOPACK 9 statement ...

Page 11

... STPS340 Information in this document is provided solely in connection with ST products. STMicroelectronics NV and its subsidiaries (“ST”) reserve the right to make changes, corrections, modifications or improvements, to this document, and the products and services described herein at any time, without notice. All ST products are sold pursuant to ST’s terms and conditions of sale. ...

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