STPS10150C STMicroelectronics, STPS10150C Datasheet
STPS10150C
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STPS10150C Summary of contents
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... C D PAK TO-220FPAB T = 145° sinusoidal µ (1) Rev 6 STPS10150C K TO-220FPAB STPS10150CFP PAK TO-220AB STPS10150CT Marking STPS10150CT STPS10150CG STPS10150CG STPS10150CFP Value 150 10 Per diode 5 Per device 10 120 = 25° C 3100 j - 175 175 10000 Unit V ...
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... 25° 125° (RMS) Figure 2. I (A) F(av) 6.0 δ = 0.5 5.0 4.0 δ 3.0 2.0 T 1.0 =tp/T d δ tp =tp/T 0.0 0 STPS10150C Value 4 7 2.4 5.3 0.7 3.7 R th(c) Min. Typ Max. 2.0 0.40 2.0 0.92 0.69 0.75 1 0.79 0.85 Average forward current versus ambient temperature (δ = 0.5, per diode) TO-220AB/D²PAK TO-220AB/D²PAK TO-220FPAB TO-220FPAB R =R th(j-a) th(j-c) R =15 ° ...
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... STPS10150C Figure 3. Normalized avalanche power derating versus pulse duration ARM p P (1µs) ARM 1 0.1 0.01 t (µs) p 0.001 0.01 0.1 1 Figure 5. Non repetitive surge peak forward current versus overload duration - maximum values, per diode (TO-220AB ( t(s) δ =0.5 0 1E-3 1E-2 Figure 7. ...
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... Figure 12. Thermal resistance, junction to R th(j- Tj=25 ° TO220FPAB STPS10150C reverse voltage applied (typical values, per diode) F=1 MHz V =30 mV OSC T =25 ° ( 100 ambient, versus copper surface under tab - Epoxy printed circuit 2 board µm (D ...
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... STPS10150C 2 Package information Epoxy meets UL94, V0. 2 Table 4. D PAK Dimensions Figure 14. D PAK footprint dimensions (in mm 2.0 MIN. FLAT ZONE V2 16.90 10.30 8.90 Package information Dimensions Ref. Millimeters Inches Min. Max. Min. A 4.40 4.60 0.173 A1 2.49 2.69 0.098 A2 0.03 0.23 0.001 B 0.70 0.93 0.027 B2 1.14 1.70 0.045 C 0 ...
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... Package information Table 5. TO-220AB Dimensions H2 Dia 6/9 Ref Diam. STPS10150C Dimensions Millimeters Inches Min. Max. Min. A 4.40 4.60 0.173 C 1.23 1.32 0.048 D 2.40 2.72 0.094 E 0.49 0.70 0.019 F 0.61 0.88 0.024 F1 1.14 1.70 0.044 F2 1.14 1.70 0.044 G 4.95 5.15 0.194 G1 2.40 2.70 0.094 H2 10 10.40 0.393 L2 16.4 typ. 0.645 typ 0.511 L5 2.65 2.95 0.104 L6 15.25 15.75 0.600 L7 6 ...
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... STPS10150C Table 6. TO-220FPAB Dimensions order to meet environmental requirements, ST offers these devices in ECOPACK® packages. These packages have a lead-free second level interconnect. The category of second level interconnect is marked on the package and on the inner box label, in compliance with JEDEC Standard JESD97. The maximum ratings related to soldering conditions are also marked on the inner box label ...
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... Ordering type STPS10150CT STPS10150CG STPS10150CG-TR STPS10150CFP 4 Revision history Date Jul-2003 19-Jun-2006 8/9 Marking Package STPS10150CT TO-220AB 2 STPS10150CG D PAK 2 STPS10150CG D PAK STPS10150CFP TO-220FPAB Revision 5B Last update. Reformatted to current standard. Added ECOPACK statement. 6 Added TO220FPAB. STPS10150C Weight Base qty Delivery mode 2. 1. 1.48 g 1000 Tape and reel 2 ...
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... STPS10150C Information in this document is provided solely in connection with ST products. STMicroelectronics NV and its subsidiaries (“ST”) reserve the right to make changes, corrections, modifications or improvements, to this document, and the products and services described herein at any time, without notice. All ST products are sold pursuant to ST’s terms and conditions of sale. ...